AD8397 Analog Devices, AD8397 Datasheet - Page 7

• Manufacturer Part Number: AD8397
• Description: Rail-to-Rail, High Output Current Amplifier
• Manufacturer: Analog Devices

Specifications of AD8397

• -3db Bandwidth: 69MHz
• Slew Rate: 53V/µs
• Vos: 1mV
• Ib: 200nA
• # Opamps Per Pkg: 2
• Input Noise (nv/rthz): 4.5nV/rtHz
• Vcc-vee: 3V to 24V
• Isy Per Amplifier: 15mA
• Packages: SOIC

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
Thermal resistance for standard JEDEC 4-layer board:
8-lead SOIC_N: θ
8-Lead SOIC_N_EP: θ
JA
1
= 157.6°C/W
JA
= 47.2°C/W
Rating
26.4 V
See Figure 4
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. A | Page 7 of 16
MAXIMUM POWER DISSIPATION
The maximum power that can be dissipated safely by the AD8397
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
ESD CAUTION
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40 –30 –20 –10
AMBIENT TEMPERATURE (°C)
8-LEAD SOIC
0
10
20
30
40
50
60
T
J
70
= 150°C
AD8397
80
90