AD8052 Analog Devices, AD8052 Datasheet - Page 9

no-image

AD8052

Manufacturer Part Number
AD8052
Description
Low Cost, High Speed, Rail-to-Rail Amplifier
Manufacturer
Analog Devices
Datasheet

Specifications of AD8052

-3db Bandwidth
110MHz
Slew Rate
170V/µs
Vos
1.7mV
Ib
1.4µA
# Opamps Per Pkg
2
Input Noise (nv/rthz)
16nV/rtHz
Vcc-vee
3V to 12V
Isy Per Amplifier
5.5mA
Packages
SOIC,SOP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD8052
Quantity:
5
Part Number:
AD8052
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8052AR
Manufacturer:
AD
Quantity:
5 510
Part Number:
AD8052AR
Manufacturer:
A/D
Quantity:
2 266
Part Number:
AD8052AR
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD8052AR
Quantity:
2 500
Part Number:
AD8052AR-REEL
Manufacturer:
AD
Quantity:
17 300
Part Number:
AD8052AR-REEL
Manufacturer:
ADI
Quantity:
9 800
Part Number:
AD8052AR-REEL
Manufacturer:
ST
0
Part Number:
AD8052AR-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8052AR-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8052ARM
Manufacturer:
AD
Quantity:
5 726
Part Number:
AD8052ARM
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD8052ARM-REEL7
Quantity:
909
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (R)
Operating Temperature Range (A Grade)
Lead Temperature (Soldering 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead SOIC
5-Lead SOT-23
8-Lead MSOP
14-Lead SOIC
14-Lead TSSOP
See Table 5.
SOIC Packages
SOT-23 Package
MSOP Package
TSSOP Package
1
θ
125
180
150
90
120
JA
12.6 V
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
±2.5 V
Observe power
derating curves
−65°C to +150°C
−40°C to +125°C
Ratings
±V
300°C
S
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. J | Page 9 of 24
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8051/AD8052/AD8054 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit can cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
While the AD8051/AD8052/AD8054 are internally short-
circuit protected, this cannot be sufficient to guarantee that the
maximum junction temperature (150°C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to
observe the maximum power derating curves.
ESD CAUTION
2.5
2.0
1.5
1.0
0.5
0
–55
TSSOP-14
MSOP-8
–35
Temperature for AD8051/AD8052/AD8054
Figure 6. Maximum Power Dissipation vs.
–15
SOIC-8
SOIC-14
AMBIENT TEMPERATURE (°C)
5
AD8051/AD8052/AD8054
SOT-23-5
15
35
55
75
95
115

Related parts for AD8052