IP5002CX8/LF,135 NXP Semiconductors, IP5002CX8/LF,135 Datasheet - Page 53

• Manufacturer Part Number: IP5002CX8/LF,135
• Description: IC MIC SGL-QUASI-DIFF NTWK 8CSP
• Manufacturer: NXP Semiconductors
• Type: Microphone Channelr

Specifications of IP5002CX8/LF,135

• Applications: Microphone
• Mounting Type: Surface Mount
• Package / Case: 8-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934058318135

104
Minimized outline drawings and refl ow soldering footprint
Dimensions in mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
max.
1.1
14
A
1
0.15
0.05
A
1
Z
pin 1 index
pin 1 index
pin 1 index
e
0.95
0.80
A
2
SOT510 (TSSOP38)
SOT360 (TSSOP20)
SOT402 (TSSOP14)
A
0.25
SOT505 (TSSOP8)
3
0.30
0.19
b
p
b
p
8
7
0.2
0.1
c
w
D
5.1
4.9
0
(1)
M
E
4.5
4.3
(2)
scale
2.5
0.65
e
H
6.6
6.2
A
E
2
A
5 mm
L
1
1
0.75
0.50
L
p
0.4
0.3
Q
detail X
0.2
v
L
L
0.13
w
p
Q
y
0.1
(A )
(A )
(A )
3
3
Z
0.72
0.38
(1)
θ
A
θ
8
0
o
o
DIMENSIONS in mm
DIMENSIONS in mm
0.650
0.500
P1
P1
DIMENSIONS in mm
0.650
P1
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
0.750
0.560
P2
P2
0.750
P2
7.200
7.200
solder land
occupied area
Ay
solder land
occupied area
Ay
7.200
solder land
occupied area
Ay
4.500
By
4.500
By
4.500
By
1.350
1.350
C
1.350
C
C
0.400
D1
0.280
0.400
D1
D1
0.600
D2
0.600
0.400
D2
D2
6.900
Gx
4.950
9.770
Gx
Gx
solder lands
5.300
Gy
5.300
Gy
5.300
Gy
7.300
5.800
5.750
Hx
10.500
Hx
Hx
7.450
7.450
Hy
Hy
3.600
7.450
SOT360 (TSSOP20)
SOT402 (TSSOP14)
Hy
0.125
SOT510 (TSSOP38)
0.600
SOT505 (TSSOP8)
occupied area
0.725
Hy
3.600
2.950
0.650
Hy
Gy
0.125
C
Hy
Gy
C
0.450
Gy
C
D2 (4x)
0.125
3.200
P2
P2
D2 (4x)
5.500
P1
Hx
Gx
P1
Hx
Gx
P1
Hx
Gx
D1
(0.125)
D1
(0.125)
(0.125)
By
D1
Ay
(0.125)
By
(0.125)
By
Ay
Ay
Minimized outline drawings and refl ow soldering footprint
Dimensions in mm
SOT984 (HXSON12)
SOT552 (TSSOP10)
SOT983 (HXSON8)
SOT519 (SSOP16)
DIMENSIONS in mm
DIMENSIONS in mm
0.400
DIMENSIONS in mm
0.500
0.635
P1
P
P1
DIMENSIONS in mm
0.400
P
1.780
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
0.550
Ay
0.660
P2
P2
1.780
Ay
0.780 0.220 2.200 0.400
By
5.400
0.780 0.220 1.400 0.400
6.600
solder land
occupied area
Ay
By
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
solder land
occupied area
Ay
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
D
D
3.200
4.200
By
By
Slx
Slx
1.100
1.200
C
Sly
C
Sly
SPx tot SPy tot
0.300
SPx tot SPy tot
1.500
0.450
D1
0.500
D1
0.400
0.500
D2
0.300
D2
0.300
2.750
0.500 0.300
5.245
Gx
SPx
0.400 0.300
Gx
SPx
SPy
3.900
4.500
Gy
SPy
Gy
1.630 1.700 1.910 1.990
Gx
2.430 1.700 2.710 1.990
3.700
Gx
5.500
Hx
Hx
Gy
Gy
5.650
SOT984 (HXSON12)
6.850
Hy
SOT552 (TSSOP10)
Hx
Hy
SOT983 (HXSON8)
SOT519 (SSOP16)
Hx
Hy
nSPx nSPy
Hy
1
nSPx nSPy
2
1
Hy
1
Hy
Ay
Hy
Gy
C
Hy
Gy
Gy
C
Ay
By
Gy
By
P2
D2 (4x)
D2 (4x)
D
D
D
D
D
D
D
D
D
D
D
D
nSPx
P1
P1
SPx tot
Hx
Gx
SLx
Hx
Gx
P
P
P
P
P
P
Hx
Gx
SPx tot
SLx
Hx
Gx
P
P
P
P
P
P
SPx
SPx
(0.125)
D1
(0.125)
D1
0.05
0.05
0.05
SPy
0.05
SPy
(0.125)
By
SPy tot
(0.125)
SPy tot
By
Ay
Ay
SLy
SLy
105