BYV25D-600 NXP Semiconductors, BYV25D-600 Datasheet - Page 3

Ultrafast power diode in a SOT428 (DPAK) surface-mountable plastic package

BYV25D-600

Manufacturer Part Number
BYV25D-600
Description
Ultrafast power diode in a SOT428 (DPAK) surface-mountable plastic package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
5. Thermal characteristics
Table 4.
[1]
BYV25D-600_1
Product data sheet
Symbol
R
R
Fig 1.
th(j-mb)
th(j-a)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Transient thermal impedance from junction to mounting base as a function of pulse width
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to ambient in free air
Thermal characteristics
Z
(K/W)
th(j-mb)
10
10
10
10
1
1
2
3
10
6
10
5
Rev. 01 — 29 July 2008
10
4
Conditions
with heatsink compound;
see
10
3
Figure 1
10
P
2
10
t
p
T
1
003aac235
1
=
t
p
(s)
t
T
t
p
10
[1]
Min
-
-
BYV25D-600
Rectifier diode, ultrafast
Typ
-
50
© NXP B.V. 2008. All rights reserved.
Max
3.0
-
Unit
K/W
K/W
3 of 9

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