BAS40_1PSXXSB4X_SER NXP Semiconductors, BAS40_1PSXXSB4X_SER Datasheet - Page 14

• Manufacturer Part Number: BAS40_1PSXXSB4X_SER
• Description: General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plasticpackages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 20. Reflow soldering footprint SOD123F
Fig 21. Reflow soldering footprint SOD882
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.6
R = 0.05 (8×)
solder lands
solder resist
occupied area
solder paste
BAS40 series; 1PSxxSB4x series
(2×)
1.1
Rev. 08 — 13 January 2010
0.90
4.4
2.9
1.6
4
0.30
0.40
0.50
(2×)
(2×)
(2×)
0.30
1.30
1.1 1.2
General-purpose Schottky diodes
R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
mbl872
0.80
(2×)
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