BAS70_1PS7XSB70_SER NXP Semiconductors, BAS70_1PS7XSB70_SER Datasheet
BAS70_1PS7XSB70_SER
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BAS70_1PS7XSB70_SER Summary of contents
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BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 ...
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... Pin BAS70H; 1PS76SB70; 1PS79SB70 1 2 BAS70L 1 2 BAS70; BAS70W BAS70-04; BAS70-04W BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Quick reference data Parameter Conditions forward current forward voltage I F reverse voltage ≤ 300 μs; δ ≤ 0.02. p Pinning Description cathode ...
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... BAS70-07S; BAS70-07V BAS70VV BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2) cathode (diode 1) cathode (diode 2) ...
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... BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Pinning …continued Description anode (diode 1) cathode (diode 2) anode (diode 3), cathode (diode 4) anode (diode 4) cathode (diode 3) cathode (diode 1), anode (diode 2) ...
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... Symbol Per diode FRM I FSM amb T stg = 25 °C prior to surge. [ BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Marking codes [1] Marking code 73* 74* 74* 75* Limiting values Parameter Conditions reverse voltage forward current repetitive peak forward ...
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... Characteristics Table amb Symbol Per diode [1] Pulse test: t BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient SOT23 SOT143B SOT363 (BAS70-07S) SOT666 (BAS70VV) SOT666 (BAS70-07V) SOD123F SOD323 ...
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... Forward current as a function of forward voltage; typical values dif (Ω − kHz Fig 3. Differential forward resistance as a function of forward current; typical values BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series mra803 0.6 0 (V) F Fig 2. mra802 (mA) F Fig 4. Rev. 09 — ...
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... Dimensions in mm Fig 5. Package outline SOD323 (SC-76) 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm Fig 9. Package outline SOD882 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 1.1 0.8 0.45 0.15 1.65 1.55 0.25 0.10 03-12-17 Dimensions in mm Fig 6. 1.1 0.9 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 Dimensions in mm Fig 8. 0.50 0.46 2.2 1.02 2.0 0.95 03-04-17 Dimensions in mm Fig 10. Package outline SOT323 (SC-70) Rev. 09 — ...
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... NXP Semiconductors 3.0 2.8 1.9 4 2.5 1.4 2.1 1.2 1 0.88 0.78 1.7 Dimensions in mm Fig 11. Package outline SOT143B Fig 13. Package outline SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 1.1 0.9 3 0.45 0.15 2.2 2.0 2 0.48 0.15 0.38 0.09 Dimensions in mm 04-11-16 Fig 12. Package outline SOT363 (SC-88) 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 0.5 1 Dimensions in mm Rev. 09 — 13 January 2010 General-purpose Schottky diodes 2 ...
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... BAS70VV BAS70XY [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series Packing methods Description SOD323 4 mm pitch tape and reel SOD523 2 mm pitch tape and reel ...
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... NXP Semiconductors 10. Soldering Fig 14. Reflow soldering footprint SOD323 (SC-76) Fig 15. Wave soldering footprint SOD323 (SC-76) Fig 16. Reflow soldering footprint SOD523 (SC-79) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2×) Dimensions in mm 5.00 4.40 1.40 2.75 1.20 preferred transport direction during soldering Dimensions in mm 1.20 solder lands solder paste solder resist occupied area Reflow soldering is the only recommended soldering method ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Fig 18. Wave soldering footprint SOT23 (TO-236AB) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.90 2.50 2 0.85 3.00 1.30 0.85 3 1.00 3.30 Dimensions in mm 3.40 1.20 (2x) 2 1.20 3 2.80 4.50 Dimensions in mm Rev. 09 — 13 January 2010 General-purpose Schottky diodes solder lands solder resist 1 occupied area 2 ...
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... NXP Semiconductors Fig 19. Reflow soldering footprint SOD123F Fig 20. Reflow soldering footprint SOD882 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions 0.05 (8×) 0.90 0.30 solder lands (2×) 0.40 solder paste (2×) 0.50 solder resist (2× ...
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... NXP Semiconductors Fig 21. Reflow soldering footprint SOT323 (SC-70) Fig 22. Wave soldering footprint SOT323 (SC-70) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.65 0.75 1.30 3 0.60 2.35 0.85 (3×) 0.55 (3×) 2.40 Dimensions in mm 4.60 4.00 1. 3.65 2.10 1 preferred transport direction during soldering Dimensions in mm Rev. 09 — 13 January 2010 General-purpose Schottky diodes 1.325 ...
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... NXP Semiconductors Fig 23. Reflow soldering footprint SOT143B Fig 24. Wave soldering footprint SOT143B BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x) 4 2.70 1 0.90 1.00 2.50 Dimensions in mm 4.45 1.20 (3× 1.00 3.40 Dimensions in mm Rev. 09 — 13 January 2010 General-purpose Schottky diodes solder lands solder resist 3 occupied area 1 ...
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... NXP Semiconductors Fig 25. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 26. Wave soldering footprint SOT363 (SC-88) BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.35 0.50 solder paste (4×) solder lands solder resist occupied area Dimensions in mm 1.3 1.3 2.45 5.3 Rev. 09 — 13 January 2010 General-purpose Schottky diodes 2.65 0.60 (2×) 0.40 0.90 2.10 (2×) 0.50 (4×) 1 ...
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... NXP Semiconductors 2 1.7 Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2×) 1.7 0.45 (4×) 0.5 (4×) Reflow soldering is the only recommended soldering method. Rev. 09 — 13 January 2010 General-purpose Schottky diodes 0.4 0.3 0.25 (6×) (2×) (2×) 0.325 0.375 Dimensions in mm (4× ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date BAS70_1PS7XSB70_SER_9 20100113 Modifications: BAS70_1PS7XSB70_SER_8 20060504 BAS70_1PS7XSB70_SER_7 20050718 1PS76SB70_2 20040126 1PS79SB70_1 19980716 BAS70H_1 20050425 BAS70L_1 20030520 BAS70-07V_1 20020117 BAS70VV_1 20040910 BAS70W_3 19990326 BAS70-07S_4 20030411 BAS70_SERIES_6 20011011 BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series ...
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... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13. Contact information For more information, please visit: For sales office addresses, please send an email to: BAS70_1PS7XSB70_SER_9 Product data sheet BAS70 series; 1PS7xSB70 series [3] Definition This document contains data from the objective specification for product development. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com General-purpose Schottky diodes All rights reserved. Date of release: 13 January 2010 Document identifier: BAS70_1PS7XSB70_SER_9 ...