BAV23_SER NXP Semiconductors, BAV23_SER Datasheet

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BAV23_SER

Manufacturer Part Number
BAV23_SER
Description
Dual high-voltage switching diodes, encapsulated in small Surface-MountedDevice (SMD) plastic packages
Manufacturer
NXP Semiconductors
Datasheet
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Dual high-voltage switching diodes, encapsulated in small Surface-Mounted
Device (SMD) plastic packages.
Table 1.
Table 2.
[1]
Type number
BAV23A
BAV23C
BAV23S
BAV23
Symbol
Per diode
I
V
t
R
rr
R
BAV23 series
Dual high-voltage switching diodes
Rev. 07 — 19 March 2010
High switching speed: t
Low leakage current
Repetitive peak reverse voltage:
V
High-speed switching at high voltage
High-voltage general-purpose switching
When switched from I
RRM
 250 V
Product overview
Quick reference data
Parameter
reverse current
reverse voltage
reverse recovery time
F
Package
NXP
SOT23
SOT23
SOT23
SOT143B
= 10 mA to I
rr
 50 ns
R
= 10 mA; R
V
Conditions
R
= 200 V
L
= 100 ; measured at I
JEDEC
TO-236AB
TO-236AB
TO-236AB
-
Low capacitance: C
Small SMD plastic package
[1]
Min
-
-
-
R
= 1 mA.
Typ
-
-
-
Product data sheet
Configuration
dual common anode
dual common cathode
dual series
dual isolated
d
 2 pF
Max
100
200
50
nA
Unit
V
ns

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BAV23_SER Summary of contents

Page 1

BAV23 series Dual high-voltage switching diodes Rev. 07 — 19 March 2010 1. Product profile 1.1 General description Dual high-voltage switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAV23A BAV23C BAV23S BAV23 1.2 Features ...

Page 2

... BAV23A BAV23C BAV23S BAV23 BAV23_SER_7 Product data sheet Pinning Description cathode (diode 1) cathode (diode 2) common anode anode (diode 1) anode (diode 2) common cathode anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1) All information provided in this document is subject to legal disclaimers ...

Page 3

... Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM BAV23_SER_7 Product data sheet Ordering information Package Name Description - plastic surface-mounted package; 3 leads - plastic surface-mounted package; 4 leads Marking codes Limiting values Parameter Conditions ...

Page 4

... Symbol Per diode [1] When switched from I BAV23_SER_7 Product data sheet Limiting values …continued Parameter total power dissipation junction temperature ambient temperature storage temperature Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Characteristics  ...

Page 5

... Forward current as a function of forward voltage; typical values = 150 C (1) T amb = 85 C (2) T amb = 25 C (3) T amb = 40 C (4) T amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV23_SER_7 Product data sheet 006aab212 I FSM (A) (2) (3) (4) 10 1.2 1.6 V (V) F Fig 2. ...

Page 6

... D.U. Ω × ( Fig 6. Reverse recovery time test circuit and waveforms BAV23_SER_7 Product data sheet mbg447 300 I F (mA) 200 100 (V) R FR4 PCB, standard footprint (1) Single diode loaded. (2) Double diode loaded. Fig 5. ...

Page 7

... Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAV23A BAV23C BAV23S BAV23 [1] For further information and the availability of packing methods, see BAV23_SER_7 Product data sheet 1.1 0.9 0.45 0.15 2.5 2.1 2 0.48 0.15 0.38 0.09 ...

Page 8

... NXP Semiconductors 11. Soldering 3 1.7 Fig 9. 2.6 4.6 Fig 10. Wave soldering footprint SOT23 (TO-236AB) BAV23_SER_7 Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. Rev. 07 — 19 March 2010 BAV23 series Dual high-voltage switching diodes ...

Page 9

... NXP Semiconductors 0.7 (3×) 0.7 Fig 11. Reflow soldering footprint SOT143B 4.6 Fig 12. Wave soldering footprint SOT143B BAV23_SER_7 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. Rev. 07 — 19 March 2010 BAV23 series Dual high-voltage switching diodes 2 3 Dimensions in mm 1.2 (3× ...

Page 10

... Product data sheet Product specification Product specification All information provided in this document is subject to legal disclaimers. Rev. 07 — 19 March 2010 BAV23 series Dual high-voltage switching diodes Change notice Supersedes - BAV23_SER_6 Table 8 - BAV23S_5 BAV23_2 - BAV23S_4 - BAV23_1 © NXP B.V. 2010. All rights reserved ...

Page 11

... Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or BAV23_SER_7 Product data sheet [3] Definition This document contains data from the objective specification for product development. ...

Page 12

... NXP Semiconductors 14. Contact information For more information, please visit: For sales office addresses, please send an email to: BAV23_SER_7 Product data sheet http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 07 — 19 March 2010 BAV23 series Dual high-voltage switching diodes © ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 19 March 2010 Document identifier: BAV23_SER_7 ...

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