IP4352CX24 NXP Semiconductors, IP4352CX24 Datasheet

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IP4352CX24

Manufacturer Part Number
IP4352CX24
Description
The IP4352CX24 is a diode array designed to provide protection to downstreamcomponents against ElectroStatic Discharge (ESD) voltages as high as 15 kV
Manufacturer
NXP Semiconductors
Datasheet

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IP4352CX24/LF
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1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
The IP4352CX24 is a diode array designed to provide protection to downstream
components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.
The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes
in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon
semiconductor technology.
These features make the IP4352CX24 ideal for applications requiring miniaturized
components, such as mobile phone handsets, cordless telephones and personal digital
devices.
IP4352CX24
9-channel SD memory card interface filter with ESD protection
to IEC 61000-4-2 level 4
Rev. 02 — 3 May 2010
Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant)
All SD memory card channels have integrated ESD protection EMI and RF filters
ESD protection up to 15 kV at output terminals on 9 channels
Integrated EMI and RF filters with pull-up resistors on 5 channels
Integrated EMI and RF filters on 4 channels
SD card power supply protection
WLCSP with 0.4 mm pitch
Write protection with integrated card detect biasing resistor
Supports electrical card detection
Also available with different filter behavior and the same footprint as IP4350CX24
SD memory card interfaces in cellular and PCS mobile handsets
DECT handsets
Digital still and video cameras
Media players
Card readers
Product data sheet

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IP4352CX24 Summary of contents

Page 1

... General description The IP4352CX24 is a diode array designed to provide protection to downstream components against ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon semiconductor technology. ...

Page 2

... SD memory card interface filter with ESD protection bump A1 index area solder balls facing down Pin configuration IP4352CX24 Pinning Description DATA2: data line 2 DATA3: data line 3 GND_H: ground 1 SDDATA2: secure digital data 2 SDDATA3: secure digital data 3 CD: card detect CMD: command ...

Page 3

... DATA0 DATA1 DATA2 DATA3 CD WP WP+CD R21 DAT3_PD GND_H Fig 2. Schematic diagram IP4352CX24 IP4352CX24_2 Product data sheet 9-channel SD memory card interface filter with ESD protection Pinning …continued Description DATA0: data line 0 GND_C: ground 3 SDDATA1: secure digital data 1 SDDATA0: secure digital data 0 Description wafer level chip-size package ...

Page 4

... DAT3_PD = 0 V; pin VSD = card to I/O interface pins DAT3_PD, DAT3_PU and VSD per channel All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 Min −0.5 −8 [1] −15 −2 − ° °C - − ...

Page 5

... 100 kΩ TEST BOARD V gen Frequency response measurement configuration All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 Min Typ Max Unit = 50 Ω Ω gen Min Typ Max Unit - - ...

Page 6

... Pin E1 to E4. (3) Pin C2 to C4. Fig 4. 7.2 Crosstalk The crosstalk between adjacent channels within the IP4352CX24 for different channel pairs was measured Ω NetWork Analyzer (NWA) system. The configuration for measuring crosstalk Ω system is shown in Fig 5. The crosstalk measured for five different pairs of channels is shown in cases, all unused connections are terminated with 50 Ω ...

Page 7

... SD memory card interface filter with ESD protection Measured crosstalk between different channels All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 001aaj788 (1) (2) ( (MHz) © NXP B.V. 2010. All rights reserved. ...

Page 8

... NXP Semiconductors 8. Package outline WLCSP24: wafer level chip-size package; 24 bumps ( B3) bump A1 index area European projection Fig 7. Package outline IP4352CX24 (WLCSP24) Table 7. Dimensions for Figure 7 Symbol Min A 0. 0.21 D 1.96 E 1. IP4352CX24_2 Product data sheet ...

Page 9

... The device is capable of withstanding at least three reflows of this profile. Pb-free solder reflow profile All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 Value or specification 200 μm 100 μm (0.004 inch) 370 μm 20 μ μm AuNi ...

Page 10

... All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 Min Typ Max 230 - 260 60 - 180 - - 150 - - 540 − 2.5 - 4.0 Change notice Supersedes - IP4352CX24_1 - - © NXP B.V. 2010. All rights reserved. Unit ° °C/s °C ...

Page 11

... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 © NXP B.V. 2010. All rights reserved ...

Page 12

... NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 IP4352CX24 © NXP B.V. 2010. All rights reserved ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4352CX24 All rights reserved. Date of release: 3 May 2010 Document identifier: IP4352CX24_2 ...

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