BAT30F3 STMicroelectronics, BAT30F3 Datasheet
BAT30F3
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BAT30F3 Summary of contents
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... IEC 61000-4-2 level 1: – ±2kV (air discharge) – ±2kV (contact discharge) Description The BAT30F3 is a Schottky diode in a 2-bump, Flip-Chip package. This device is specially suited for switching mode applications needing a low forward voltage drop diode. The electrical parameters are guaranteed across the operating temperature range (- 30 ° ...
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... F 25 ° 100 200 300 0 ° 100 200 300 mA F Doc ID 16915 Rev 2 BAT30F3 Value Unit ±2 kV ± -55 to +150 °C -30 to +85 °C Typ. Max. Unit - - µ 145 ...
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... BAT30F3 Figure 3. Leakage current versus reverse applied voltage (typical values) I (µA) R 1.E+03 Tj=85°C (Maximum specified values) T =85°C 1.E+ =55°C j 1.E+01 T =25°C j 1.E+00 T =0°C j 1.E-01 T =-30°C j 1.E-02 1.E- Figure 5. Forward voltage drop versus forward current (typical values, negative temperatures) I (A) FM 1.E+00 1.E- =-20°C =-20° ...
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... Ordering information scheme 2 Ordering information scheme Figure 7. Ordering information scheme 4/10 Signal Schottky diode RRM Package F = Flip Chip lead-free, pitch = 400 µm Doc ID 16915 Rev 2 BAT30F3 BAT30 F3 ...
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... BAT30F3 3 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. ...
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... Track layout must be symmetrical to the die axis (to homogenize stress and welding attraction during reflow assembly) Oblong pad: – Micro via SSBU allowed – Micro via SBU to be avoided – Micro via SBU filled (under qualification) Cu – Ni (2-6 µ (0.2 µm max) Doc ID 16915 Rev 2 BAT30F3 Ø 1.55 ± 0.05 2.0 ± 0.1 Table 3. ...
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... BAT30F3 To optimize the natural self centering effect of CSP on the PCB, PCB pad positioning and size have to be properly designed (see Micro vias An alternative to routing on the top surface is to route out on buried layers. To achieve this, the pads are connected to the lower layers using micro vias. Only SSBU via technology is approved ...
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... Doc ID 16915 Rev 2 Figure 11. 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max 90 sec max BAT30F3 ...
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... BAT30F3 5 Ordering information Table 4. Ordering information Order code BAT30F3 6 Revision history Table 5. Document revision history Date Revision 14-Dec-2009 21-Oct-2010 Marking Package 3 Flip Chip 1 Initial release. 2 Updated dot graphic in Figure Doc ID 16915 Rev 2 Ordering information Weight Base qty Delivery mode 0.3 mg 15000 Tape and reel 7” ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 16915 Rev 2 BAT30F3 ...