74LCX244MTCX Fairchild Semiconductor, 74LCX244MTCX Datasheet - Page 12

IC BUFF DVR LOW V N-INV 20TSSOP

74LCX244MTCX

Manufacturer Part Number
74LCX244MTCX
Description
IC BUFF DVR LOW V N-INV 20TSSOP
Manufacturer
Fairchild Semiconductor
Series
74LCXr
Datasheet

Specifications of 74LCX244MTCX

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Logic Family
74LCX
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
10 uA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
8
Output Type
3-State
Propagation Delay Time
7.5 ns @ 2.7 V or 6.5 ns @ 3.3 V
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
2.5/3.3V
Package Type
TSSOP
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Quiescent Current
10uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2V To 3.6V
Logic Case Style
TSSOP
No. Of Pins
20
Operating Temperature Range
-40°C To +85°C
Filter Terminals
SMD
Rohs Compliant
Yes
Family Type
LCX
Dc
0642
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LCX244MTCX
74LCX244MTCXTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LCX244MTCX
Manufacturer:
XILINX
0
Part Number:
74LCX244MTCX
Manufacturer:
FSC
Quantity:
20 000
Company:
Part Number:
74LCX244MTCX
Quantity:
4 500
©1994 Fairchild Semiconductor Corporation
74LCX244 Rev. 1.12.1
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
(Continued)
12
www.fairchildsemi.com

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