74LCX245MTC Fairchild Semiconductor, 74LCX245MTC Datasheet - Page 9

• Manufacturer Part Number: 74LCX245MTC
• Description: IC TRANSCVR 8BIT BI-DIR 20TSSOP
• Manufacturer: Fairchild Semiconductor
• Series: 74LCXr

Specifications of 74LCX245MTC

• Logic Type: Transceiver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Logic Family: 74LCX
• Number Of Channels Per Chip: 8
• Input Level: LVTTL, TTL
• Output Level: LVCMOS
• Output Type: 3-State
• High Level Output Current: - 24 mA
• Low Level Output Current: 24 mA
• Propagation Delay Time: 8 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Function: Transceiver
• Input Bias Current (max): 10 uA
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Circuits: 1
• Polarity: Non-Inverting
• Logic Device Type: Transceiver, Non Inverting
• Supply Voltage Range: 2V To 3.6V
• Logic Case Style: TSSOP
• No. Of Pins: 20
• Operating Temperature Range: -40°C To +85°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: LCX
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

©1994 Fairchild Semiconductor Corporation
74LCX245 Rev. 1.11.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
10.65
10.00
INDICATOR
(R0.10)
PIN ONE
8°
0°
(R0.10)
7.60
7.40
B
Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
2.65 MAX
1.27
0.40
(1.40)
20
1
SEATING PLANE
DETAIL A
0.75
0.25
SCALE: 2:1
0.35
0.51
0.25
13.00
12.60
11.43
X 45°
GAGE PLANE
0.25
M
C
B
A
1.27
0.30
0.10
11
10
NOTES: UNLESS OTHERWISE SPECIFIED
A
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
9
C
0.10 C
MS-013, VARIATION AC, ISSUE E
FLASH OR BURRS.
LAND PATTERN RECOMMENDATION
2.25
1.27
SEE DETAIL A
SEATING PLANE
0.65
www.fairchildsemi.com
0.33
0.20
9.50