SEMiX453GD176HDc SEMIKRON, SEMiX453GD176HDc Datasheet - Page 2

• Manufacturer Part Number: SEMiX453GD176HDc
• Manufacturer: SEMIKRON

Specifications of SEMiX453GD176HDc

• Family/system: SEMiX
• Voltage (v): 1700
• Current (a): 300
• Chip-type: IGBT 3 (Trench)
• Case: SEMiX 33c

SEMiX453GD176HDc
Trench IGBT Modules
SEMiX453GD176HDc
Features
• Homogeneous Si
• Trench = Trenchgate technology
• V
• UL recognised file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic welders
2
SEMiX
coefficient
CE(sat)
with positive temperature
®
33c
GD
Characteristics
Symbol
Inverse diode
V
V
r
I
Q
E
R
Module
L
R
R
M
M
w
Temperatur Sensor
R
B
F
RRM
CE
F
F0
rr
100/125
th(j-c)
CC'+EE'
th(c-s)
100
rr
s
t
= V
EC
Rev. 1 – 24.06.2010
I
V
chip
I
di/dt
V
V
res., terminal-chip
Conditions
per diode
per module
to heat sink (M5)
T
R
T[K];
F
F
GE
GE
CC
c
(T)
= 300 A
= 300 A
=100°C (R
=R
off
= 0 V
= -15 V
= 1200 V
= 4700 A/µs
100
exp[B
25
=5 kΩ)
100/125
T
T
T
T
T
T
T
T
T
T
T
to terminals (M6)
(1/T-1/T
j
j
j
j
j
j
j
j
j
C
C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 125 °C
= 125 °C
= 125 °C
= 25 °C
= 125 °C
100
)];
min.
0.9
0.7
1.3
1.8
2.5
3
493 ± 5%
0.014
3550
±2%
typ.
350
115
1.5
1.4
1.1
0.9
1.3
1.8
0.7
65
20
1
© by SEMIKRON
max.
1.70
0.11
900
1.6
1.3
1.1
1.3
1.8
5
5
Unit
K/W
K/W
mΩ
mΩ
mΩ
mΩ
Nm
Nm
Nm
µC
mJ
nH
Ω
V
V
V
V
A
g
K