LDBK2640-AS/H Ligitek Group, LDBK2640-AS/H Datasheet - Page 5

• Manufacturer Part Number: LDBK2640-AS/H
• Manufacturer: Ligitek Group

Specifications of LDBK2640-AS/H

• Chip Material: InGaN/GaN
• Chip Peak: 470
• Lens Color: Blue Diffused
• Forward Voltage(vf) Min.: -
• Forward Voltage(vf) Max.: 4.0
• Iv(mcd) Typ.: 450
• Viewing Angle 2?½: 38
• Pb: Yes
• Mounting Style: Through Hole

PART NO. LDBK2640-AS/H
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to body)
Note: 1.Wave solder should not be made more than one time.
Solder Bath:265 ° C Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2°C/sec(max)
Soldering Iron:30W Max
Temp(° C)
2.You can just only select one of the soldering conditions as above.
260°
120°
25°
0°
0
60 Seconds Max
Preheat
2° /sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
265° C5sec Max
Property of Ligitek Only
max
5°/sec
100
Time(sec)
150
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