L8Y3330/S227-PF/TRS-8 Ligitek Group, L8Y3330/S227-PF/TRS-8 Datasheet - Page 6

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L8Y3330/S227-PF/TRS-8

Manufacturer Part Number
L8Y3330/S227-PF/TRS-8
Description
Manufacturer
Ligitek Group
Datasheet

Specifications of L8Y3330/S227-PF/TRS-8

Chip Material
GaAsP/GaP
Chip Peak
585
Lens Color
Yellow Diffused
Forward Voltage(vf) Min.
1.7
Forward Voltage(vf) Max.
-
Iv(mcd) Typ.
28
Viewing Angle 2?½
28
Pb
Yes
Mounting Style
Through Hole
PART NO.
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Note: 1.Wave solder should not be made more than one time.
Soldering Time:3 Seconds Max(One time only)
2° C/sec(max)
Solder Bath:260°C Max
Temperature 350 °C Max
Distance:2mm Min(From solder joint to body)
Soldering Iron:30W Max
Temp(° C)
2.You can just only select one of the soldering conditions as above.
120°
260°
L8Y3330/S227-PF/TRS-8
25°
0
60 Seconds Max
Preheat
2° /sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5°/sec
max
100
Time(sec)
150
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