L8G5730 Ligitek Group, L8G5730 Datasheet

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L8G5730

Manufacturer Part Number
L8G5730
Description
Manufacturer
Ligitek Group
Datasheet

Specifications of L8G5730

Chip Material
GaP
Chip Peak
565
Lens Color
Green Diffused
Forward Voltage(vf) Min.
1.7
Forward Voltage(vf) Max.
-
Iv(mcd) Typ.
8
Viewing Angle 2?½
144
Pb
Yes
Mounting Style
Through Hole

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L8G5730
Manufacturer:
LIGITEK
Quantity:
40 000
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
RECTANGLE TYPE LED LAMPS
Pb
Lead-Free Parts
L8G5730
DATA SHEET
DOC. NO :
QW0905-L8G5730
REV.
: A
DATE
:
19 - Jul. - 2007

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L8G5730 Summary of contents

Page 1

... RECTANGLE TYPE LED LAMPS DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8G5730 DATA SHEET QW0905-L8G5730 : Jul. - 2007 Pb Lead-Free Parts ...

Page 2

... PART NO. L8G5730 Package Dimensions 1.5MAX Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 7.1 7.8 25.0MIN □ 0.5 TYP 1.0MIN 2.54TYP + - Page 1/5 2.4 2.5 ...

Page 3

... PART NO. L8G5730 Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL Emitted GaP Green Green Diffused L8G5730 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...

Page 4

... PART NO. L8G5730 Typical Electro-Optical Characteristics Curve 8G CHIP Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Fig.4 Relative Intensity vs. Temperature ...

Page 5

... PART NO. L8G5730 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° ...

Page 6

... PART NO. L8G5730 Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1.Ta=105 ...

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