LG27460/S23-PF Ligitek Group, LG27460/S23-PF Datasheet - Page 5

• Manufacturer Part Number: LG27460/S23-PF
• Manufacturer: Ligitek Group

Specifications of LG27460/S23-PF

• Chip Material: GaP
• Chip Peak: 565
• Lens Color: Green Diffused
• Forward Voltage(vf) Min.: 1.7
• Forward Voltage(vf) Max.: 2.6
• Iv(mcd) Typ.: 3.6
• Viewing Angle 2?½: 180
• Pb: Yes
• Mounting Style: Through Hole

PART NO. L
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
2°C/sec(max)
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
Temp(° C)
260°
120°
25°
G27460/S23-PF
0°
0
60 Seconds Max
Preheat
2° /sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5°/sec
max
100
Time(sec)
150
Page 4/5