LDGM9033/TR1 Ligitek Group, LDGM9033/TR1 Datasheet - Page 6

• Manufacturer Part Number: LDGM9033/TR1
• Manufacturer: Ligitek Group

Specifications of LDGM9033/TR1

• Chip Material: InGaN/GaN
• Chip Peak: 525
• Lens Color: Water Clear
• Forward Voltage(vf) Min.: -
• Forward Voltage(vf) Max.: 4.0
• Iv(mcd) Typ.: 1800
• Viewing Angle 2?½: 20
• Pb: Yes
• Mounting Style: Surface Mount

1.
2. Wave Solder
PART NO.
Recommended Soldering Conditions
3-1. LEAD Reflow Solder
3-2 PB-Free Reflow Solder
Hand Solder
Basic spec is ≦ 280 ℃ 3 sec one time only.
Reflow Soldering should not be done more than two times.
LDGM9033/TR1
120 ~ 150 ℃
Temp.
( ℃ )
150
120
240
1~5° C/sec
Soldering heat Max. 260 ℃
60 ~ 120 sec
120 ~ 180 sec
Preheat
Preheat
120 sec.Max.
Rising
+5
180~200° C
℃
Preheat
/sec
1~5° C/sec
5sec
LIGITEK ELECTRONICS CO.,LTD.
Above 220° C
60 sec.Max.
Property of Ligitek Only
Cooling
-5
℃
/sec
245 ± 5 ℃ within 5 sec
Time
10sec.Max
260° C MaX.
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