ISD1790 Winbond, ISD1790 Datasheet

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ISD1790

Manufacturer Part Number
ISD1790
Description
Manufacturer
Winbond
Datasheet

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PRELIMINARY
ISD1700
Series
Multi-Message
Single-Chip
Voice Record & Playback Devices
Publication Release Date: January 23, 2007
Revision 1.3-S2

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ISD1790 Summary of contents

Page 1

ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices PRELIMINARY Publication Release Date: January 23, 2007 Revision 1.3-S2 ...

Page 2

TABLE OF CONTENTS 1 GENERAL DESCRIPTION ..............................................................................................................3 2 FEATURES......................................................................................................................................4 3 BLOCK DIAGRAM...........................................................................................................................5 4 PINOUT CONFIGURATION............................................................................................................6 5 PIN DESCRIPTION .........................................................................................................................7 6 MODES OF OPERATIONS .............................................................................................................8 6.1 Standalone (Push-Button) Mode .............................................................................................8 6.2 SPI Mode .................................................................................................................................8 7 TIMING DIAGRAMS ........................................................................................................................8 7.1 Standalone Operation ...

Page 3

... Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products. Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes. ...

Page 4

... High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical) o 100,000 record cycles (typical) 8 kHz 6.4 kHz 53 kΩ 80 kΩ 100 kΩ ISD1750 ISD1760 ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240 33 secs 40 secs 60 secs 50 secs 60 secs 90 secs 62 secs 75 secs 112 secs 75 secs ...

Page 5

Temperature options: Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units) o Industrial: -40°C to +85°C (packaged units) o Packaging types: available in die, PDIP, SOIC and TSOP Package option: Lead-free packaged units 3 BLOCK DIAGRAM Internal R Clock ...

Page 6

PINOUT CONFIGURATION Refer to Design Guide for details before performing any design or PCB layout. V CCD LED RESET MISO MOSI SCLK SS V SSA AnaIn MIC+ MIC- V SSP2 SP- V CCP V SSA AnaIn MIC+ MIC- V ...

Page 7

PIN DESCRIPTION Refer to Design Guide for details before performing any design or PCB layout. PIN NAME V Digital Power Supply: Power supply for digital circuitry. CCD LED: An LED output. LED RESET: When active, the device enters into ...

Page 8

MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6 TANDALONE USH One can utilize the REC desired operation. As completed, the device automatically enters into the power-down state. ...

Page 9

T T Deb r PLAY T Deb RDY Sc1 Sc2 LED Sp+, Sp- Figure 12.2: Start and Stop Playback Operation T r ERASE T Deb RDY T T Sc1 Sc2 LED Figure 12.3: Single Erase Operation ...

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T r FWD T Deb RDY T T Sc2 Sc1 LED Figure 12.4: Forward Operation with No Sound Effect T r ERASE T Deb RDY T T Sc1 Sc2 LED Sp+, Sp- Note: If SEs are recorded, then Sp+/- will ...

Page 11

RESET T Reset RDY LED Figure 12.6: Reset Operation T r PLAY T Deb RDY Sc1 Sc2 LED T AUD Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD ...

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SPI O PERATION SCKlow SSS SCLK T MOSI T PD (TRISTATE) MISO Figure 12.8: SPI Operation PARAMETER SS Setup Time SS Hold Time Data in Setup Time Data in Hold Time Output Delay Output Delay to ...

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ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS (DIE) CONDITIONS Junction temperature Storage temperature range Voltage Applied to any pads Power supply voltage to ground potential ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) CONDITIONS Junction temperature Storage temperature range Voltage Applied to any ...

Page 14

ELECTRICAL CHARACTERISTICS DC P 9.1 ARAMETERS PARAMETER SYMBOL Supply Voltage V DD Input Low Voltage V IL Input High Voltage V IH Output Low Voltage V OL Output High Voltage V OH Record Current I DD_Record Playback Current I ...

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AC P 9.2 ARAMETERS CHARACTERISTIC SYMBOL [2] Sampling Frequency F [3] Duration T Rising Time T Falling Time T Debounce Time T Ramp Up Time T Ramp Down Time T Initial Scan Time after T power is applied Initial Scan ...

Page 16

... These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values. Please refer to the applications notes or consult Winbond for layout advice important to have a separate path for each ground and power back to the related terminals to minimize the noise ...

Page 17

Example #2: Recording using AnaIn input via push-button controls μ 0.1 F Rosc *** 4.7 F *** At 8kHz sampling freq, Rosc = REC RESET 23 PLAY 25 ERASE 2 26 LED FWD 19 VOL V ...

Page 18

... See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family.pdf Good Audio Design Practices http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf 3 24 REC RESET 23 PLAY ...

Page 19

PACKAGING 11.1 28-L 8 13.4 P EAD X MM LASTIC e b θ (TSOP) T HIN MALL UTLINE ACKAGE Dimension in Inches Dimension in mm Symbol Min. Nom. Max. ...

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P EAD IL LASTIC Plastic Small Outline Integrated Circuit (SOIC) Dimensions INCHES Min 0.701 A 0.097 ...

Page 21

... D D1 0.015 E 0.125 F 0.015 G 0.055 H J 0.008 S 0.070 0 0° 11 NFORMATION For die info, please contact the local Winbond Sales Representatives (PDIP) UAL NLINE ACKAGE INCHES Nom Max 1.450 1.455 0.150 0.070 0.075 0.625 0.540 0.550 0.19 0.135 0.018 ...

Page 22

... P 240 : 160 – 480 secs When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond Sales Representatives for any questions and the availability. For the latest product information, please contact the Winbond Sales/Rep or access Winbond’ ...

Page 23

VERSION HISTORY VERSION DATE 1.3-S Sep 2006 1.3-S1 Nov 2006 1.3-S2 Jan 2007 DESCRIPTION Initial version Revise Pinout Configuration & Pin Description sections Revise Rosc resistor value Revise Selectable Message Duration section Update standby current, sampling frequency & duration ...

Page 24

... Winbond customers using or selling these products for use in such applications their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. ...

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