MTD15N06VL ON Semiconductor, MTD15N06VL Datasheet

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MTD15N06VL

Manufacturer Part Number
MTD15N06VL
Description
Manufacturer
ON Semiconductor
Datasheet

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Part Number:
MTD15N06VL
Manufacturer:
MOT/ON
Quantity:
12 500
Part Number:
MTD15N06VLT4
Manufacturer:
ON
Quantity:
6 675
MTD15N06VL
Power MOSFET
15 Amps, 60 Volts
N−Channel DPAK
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 5
MAXIMUM RATINGS
1. When surface mounted to an FR4 board using the minimum recommended
2. When surface mounted to an FR4 board using 0.5 sq. in. pad size.
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
Drain Current − Continuous
Drain Current
Drain Current
Total Power Dissipation
Total Power Dissipation @ 25°C (Note 2)
Operating and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Thermal Resistance
Maximum Lead Temperature for Soldering
This Power MOSFET is designed to withstand high energy in the
Avalanche Energy Specified
I
DSS
− Continuous
− Non−repetitive (t
Derate above 25°C
Range
Energy − Starting T
(V
I
− Junction to Case
− Junction to Ambient (Note 1)
− Junction to Ambient (Note 2)
Purposes, 1/8″ from case for 10
seconds
pad size.
L
DD
= 15 Apk, L = 1.0 mH, R
and V
= 25 Vdc, V
DS(on)
− Continuous @ 100°C
− Single Pulse (t
Rating
GS
Specified at Elevated Temperature
p
J
≤ 10 ms)
= 5.0 Vdc, Peak
= 25°C
(T
GS
C
= 25°C unless otherwise noted)
G
= 1.0 MW)
p
= 25 W)
≤ 10 ms)
Symbol
T
V
V
V
R
R
R
V
J
E
I
P
DGR
GSM
, T
DSS
DM
T
I
I
qJC
qJA
qJA
GS
AS
D
D
D
L
stg
−55 to
Value
± 15
± 25
71.4
175
113
100
260
0.4
2.1
2.5
60
60
15
12
53
60
1
Watts
Watts
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
15N06VL Device Code
Y
WW
ORDERING INFORMATION
MTD15N06VL
MTD15N06VL−1
MTD15N06VLT4
1 2
CASE 369C
CASE 369D
1
Style 2
Style 2
DPAK
DPAK
Device
2
3
3
R
DS(on)
= Year
= Work Week
4
G
4
http://onsemi.com
15 AMPERES
60 VOLTS
Package
N−Channel
= 75 mW (Typ)
DPAK
DPAK
DPAK
D
MARKING DIAGRAMS
Publication Order Number:
S
Gate
Gate
1
1
2500 Tape & Reel
Drain
Drain
Drain
Drain
MTD15N06VL/D
75 Units/Rail
75 Units/Rail
4
4
2
2
Shipping
3
Source
3
Source

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MTD15N06VL Summary of contents

Page 1

... AMPERES 60 VOLTS (Typ) DS(on) N−Channel MARKING DIAGRAMS 4 Drain Drain 4 Gate Source 4 Drain Gate Drain Source = Year = Work Week Device Package Shipping DPAK 75 Units/Rail DPAK 75 Units/Rail DPAK 2500 Tape & Reel Publication Order Number: MTD15N06VL/D ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage ( Vdc 0.25 mAdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc, ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 10V 25° DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) g Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge ...

Page 6

SINGLE PULSE T = 25° 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum ...

Page 7

INFORMATION FOR USING THE DPAK SURFACE MOUNT PACKAGE RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper ...

Page 8

Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of ...

Page 9

For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings ...

Page 10

... K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MTD15N06VL/D ...

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