74LVC07APW,118 NXP Semiconductors, 74LVC07APW,118 Datasheet - Page 3

• Manufacturer Part Number: 74LVC07APW,118
• Description: IC BUFF HEX OPEN DRAIN 14TSSOP
• Manufacturer: NXP Semiconductors
• Series: 74LVCr

Specifications of 74LVC07APW,118

• Logic Type: Buffer/Line Driver, Non-Inverting with Open Drain
• Package / Case: 14-TSSOP
• Number Of Elements: 6
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74LVC
• Number Of Channels Per Chip: 6
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• Input Bias Current (max): 10 uA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 6 / 6
• Output Type: Open Drain
• Propagation Delay Time: 2.5 ns
• Logical Function: Buffer/Driver
• Number Of Elements: 6
• Number Of Channels: 6
• Number Of Inputs: 6
• Number Of Outputs: 6
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Package Type: TSSOP
• High Level Output Current: 32mA
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.65V
• Quiescent Current: 10uA
• Technology: CMOS
• Pin Count: 14
• Mounting: Surface Mount
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2286-2; 74LVC07APW-T; 935265482118

Philips Semiconductors
ORDERING INFORMATION
PINNING
2003 Nov 11
handbook, halfpage
74LVC07AD
74LVC07APW
74LVC07ABQ
Hex buffer with open-drain outputs
Fig.1 Pin configuration SO14 and TSSOP14.
TYPE NUMBER
PIN
10
11
12
13
14
1
2
3
4
5
6
7
8
9
GND
1A
1Y
2A
2Y
3A
3Y
1
2
3
4
5
6
7
07
MNA531
1A
1Y
2A
2Y
3A
3Y
GND
4Y
4A
5Y
5A
6Y
6A
V
TEMPERATURE RANGE
CC
14
13
12
11
10
9
8
40 to +125 C
40 to +125 C
40 to +125 C
V CC
6A
6Y
5A
5Y
4A
4Y
SYMBOL
3
data input
data output
data input
data output
data input
data output
ground (0 V)
data output
data input
data output
data input
data output
data input
supply voltage
handbook, halfpage
PINS
(1) The die substrate is attached to this pad using conductive die
14
14
14
attach material. It can not be used as a supply pin or input.
PACKAGE
Fig.2 Pin configuration DHVQFN14.
1Y
2A
2Y
3A
3Y
DHVQFN14
PACKAGE
Top view
TSSOP14
2
3
4
5
6
SO14
DESCRIPTION
GND
1A
7
1
GND
V CC
MATERIAL
(1)
4Y
14
8
plastic
plastic
plastic
Product specification
MBL760
74LVC07A
13
12
11
10
9
6A
6Y
5A
5Y
4A
SOT108-1
SOT402-1
SOT762-1
CODE