FMM5703YC Eudyna Devices Inc, FMM5703YC Datasheet - Page 10

• Manufacturer Part Number: FMM5703YC
• Description: K Band Low Noise Amplifier Mmic
• Manufacturer: Eudyna Devices Inc

Edition 3.1
Feb. 2010
■ Mounting Method of SMD(Surface Mount Devices) for Lead-free Solder
(2) A rosin type flux with a chlorine content of 0.2% or less shall be used. The rosin flux with low
(1)For soldering, Lead-free solder (Sn-3.0Ag-0.5Cu)*
(3) When soldering, use one of the following time / temperature methods for acceptable solder joints.
Reflow temperature profile and condition:
* Reflow soldering method (Infrared reflow / Heat circulation reflow / Hot plate reflow):
Mounting Condition
(4)The above-recommended conditions were confirmed using the manufacture’s equipment and
Excessive reflow cycles will effect the resin resulting in a potential failure or latent defect. The
recommended reflow temperature profile is shown below. The temperature of the reflow profile
must be measured at the device lead.
(*1: The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5%
copper.)
halogen content is recommended.
Make sure the devices have been properly prepared with flux prior soldering.
Limit solder to 3 reflow cycles because resin is used in the modules manufacturing process.
materials. However, when soldering these products, the soldering condition should be verified by
customer using their equipment and materials.
(1) Temperature rise:
(2) Preheating:
(3) Main heating:
(4) Main heating:
* Measurement point: Device lead.
260
250
220
200
150
RT
(1)
150 – 200deg-C, 60 – 180 seconds.
220deg-C, 60 seconds max...
260deg-C max. more than 250deg-C,10 seconds max..
3deg-C /seconds.
(2)
1
10
or equivalent shall be used.
K Band Low Noise Amplifier MMIC
(4)
(3)
FMM5703YC
Time