MT8JSF12864HY-1G4 Micron Semiconductor Products, MT8JSF12864HY-1G4 Datasheet

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MT8JSF12864HY-1G4

Manufacturer Part Number
MT8JSF12864HY-1G4
Description
1gb, 2gb X64, Sr 204-pin Ddr3 Sdram Sodimm
Manufacturer
Micron Semiconductor Products
Datasheet
DDR3 SDRAM SODIMM
MT8JSF12864H – 1GB
MT8JSF25664H – 2GB
For component data sheets, refer to Micron’s Web site:
Features
• DDR3 functionality and operations supported as per
• 204-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC3-10600, PC3-8500,
• 1GB (128 Meg x 64) and 2GB (256 Meg x 64)
• V
• V
• Nominal and dynamic on-die termination (ODT) for
• Single rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1:
PDF: 09005aef82b36df5/Source: 09005aef82b36dc2
JSF8C128_256x6HY.fm - Rev. B 3/08 EN
the component data sheet
(SODIMM)
or PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
Speed
Grade
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
2
Key Timing Parameters
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
PC3-10600
PC3-10600
PC3-10600
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
CL = 10
1333
1333
1333
CL = 9
1333
1333
Data Rate (MT/s)
CL = 8
1GB, 2GB (x64, SR) 204-Pin DDR3 SDRAM SODIMM
1333
1066
1066
1066
1066
www.micron.com
1
CL = 7
1066
1066
1066
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Frequency/CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 204-pin DIMM
– 1.5ns @ CL = 8 (DDR3-1333)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.5ns @ CL = 10 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
– 1.87ns @ CL = 8 (DDR3-1066)
– 2.5ns @ CL = 5 (DDR3-800)
– 2.5ns @ CL = 6 (DDR3-800)
PCB height: 30.0mm (1.18in)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Not recommended for new designs.
CL = 6
module offerings.
800
800
800
800
800
800
800
204-Pin SODIMM (MO-268 R/C B)
CL = 5
800
800
A
A
1
≤ +85°C)
≤ +70°C)
13.125
t
(ns)
13.5
12.5
©2007 Micron Technology, Inc. All rights reserved.
RCD
12
15
15
15
2
2
2
2
13.125
(ns)
12.5
13.5
t
12
15
15
15
RP
Marking
Features
None
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Y
I
50.625
(ns)
49.5
52.5
52.5
t
48
51
50
RC

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MT8JSF12864HY-1G4 Summary of contents

Page 1

DDR3 SDRAM SODIMM MT8JSF12864H – 1GB MT8JSF25664H – 2GB For component data sheets, refer to Micron’s Web site: Features • DDR3 functionality and operations supported as per the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • ...

Page 2

... The data sheets for the base devices can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8JSF12864HY-1G1B1. PDF: 09005aef82b36df5/Source: 09005aef82b36dc2 JSF8C128_256x6HY.fm - Rev. B 3/08 EN ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin DQ19 105 REF 107 SS ...

Page 4

Table 6: Pin Descriptions Symbol Type Description A[14:0] Input Address inputs: Provide the row address for ACTIVATE commands, and the column address and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array in ...

Page 5

Table 6: Pin Descriptions (continued) Symbol Type Description V Supply Ground Supply Termination voltage: Used for control, command, and address ( – No function: Connected within the module but provides no functionality. NC – No connect: ...

Page 6

Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 V SS DQS1# DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 V SS DQS2# DQS2 DM2 DQ16 DQ17 ...

Page 7

General Description The MT8JSF12864H and MT8JSF25664H DDR3 SDRAM modules are high-speed, CMOS dynamic random access 1GB and 2GB memory modules organized in a x64 configura- tion. These DDR3 SDRAM modules use internally configured, 8-bank 1Gb and 2Gb DDR3 SDRAM devices. ...

Page 8

Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JEDEC specification JC-45 “Appendix X: Serial Presence Detect (SPD) for ...

Page 9

Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each ...

Page 10

DRAM Operating Conditions Recommended AC operating conditions are given in the DDR3 component data sheets. Component specifications are available on Micron’s Web site. Module speed grades correlate with component speed grades, as shown in Table 9. Table 9: Module and ...

Page 11

I Specifications DD Table 10: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...

Page 12

Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 12: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current: ...

Page 13

The compare mode is similar to the interrupt mode, except EVENT# cannot be reset by the user and only returns to the logic HIGH state when the temperature falls below the programmed thresholds. Critical temperature mode triggers EVENT# only when ...

Page 14

Table 14: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...

Page 15

Table 18: Capability Register Bit Descriptions Bit Description 0 Basic capability 1: Has alarm and critical trip point capabilities 1 Accuracy 0: ±2°C over the active range and ±3°C over the monitor range 1: ±1°C over the active range and ...

Page 16

Table 20: Configuration Register Bit Descriptions (continued) Bit Description 5 Clear event 0: No effect 1: Clears the event when the temperature sensor is in the interrupt mode 6 Alarm window lock bit 0: Alarm trips are not locked and ...

Page 17

Table 21: Hysteresis Temperature Condition Gradient Sets Falling Clears Rising Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit (LSB) is equal to 0.0625°C or ...

Page 18

Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The LSB for this register is 0.0625°C with a resolu- tion of 0.0625°C. The most significant bit (MSB) is 128°C in ...

Page 19

Module Dimensions Figure 5: 204-Pin DDR3 SODIMM 2.0 (0.079) R (2X) U1 1.8 (0.071) (2X) 6.0 (0.236) TYP Pin 1 2.0 (0.079) TYP U6 2.55 (0.1) TYP Pin 204 Notes: 1. All dimensions are in millimeters (inches); MAX/MIN or typical ...

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