EVX10AS008BGL ETC-unknow, EVX10AS008BGL Datasheet - Page 26

• Manufacturer Part Number: EVX10AS008BGL
• Description: Adc Single 2.2gsps 10-bit Lvds 152-pin Cbga
• Manufacturer: ETC-unknow

Figure 5-2.
Note:
5.3.1
26
The cooling system efficiency can be monitored using the temperature sensing diodes, integrated in the device
0811A–BDC–12/08
Thermal Dissipation by Conduction Only (CI-CGA 152)
6.5
Black Anodized Aluminium Heat Sink Glued on a Copper Base Screwed on Board (all dimensions in mm)
0.3
When the external heat sink cannot be used, the relevant thermal resistance is the thermal resistance
from the junction to the bottom of the columns: RTH
The thermal path, in this case, is the junction, then the silicon, glue, CuW heat spreader, package Al2O3,
and the columns (Sn10Pb90).
The Finite Element Method (FEM) with the thermal simulator leads to
RTH
the columns (this is the worst case, no radiation and no convection is applied). With such an assumption,
RTH
To complete the thermal analysis, you must add the thermal resistance from the top of the board (on
which the device is soldered) to the ambient resistance, whose values are user-dependent (the type of
board, thermal, routing, area covered by copper in each board layer, thickness, airflow or cold plate are
all parameters to consider).
In the case of the CI-CGA 152 package, the thermal resistance from the junction to the top of the pack-
age (via the CuW heat spreader covered by AI203) is RTH
2
J-bottom-of-columns
J- Bottom-of-columns
= 7.4°C/W. This value assumes pure conduction from the junction to the bottom of
is user-independent.
50 x 50
50 x 52
Ø 18.50
J-Bottom-of-columns
J-top-of-package
.
= 4.8°C/W.
16 x 50
11.5 x 52
e2v semiconductors SAS 2008
EV10AS008B
Board