BYG60 NXP Semiconductors, BYG60 Datasheet

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BYG60

Manufacturer Part Number
BYG60
Description
Fast Soft-recovery Controlled Avalanche Rectifiers
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
BYG60D
Manufacturer:
NXPlips
Quantity:
15 000
Part Number:
BYG60G
Manufacturer:
NXPlips
Quantity:
15 000
Part Number:
BYG60J
Manufacturer:
NXPlips
Quantity:
15 000
Part Number:
BYG60J
Quantity:
3 150
Part Number:
BYG60K
Manufacturer:
NXPlips
Quantity:
15 000
Company:
Part Number:
BYG60K
Quantity:
1 500
Product specification
Supersedes data of 1996 June 05
DATA SHEET
BYG60 series
Fast soft-recovery
controlled avalanche rectifiers
k, halfpage
M3D168
DISCRETE SEMICONDUCTORS
2000 Jul 03

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BYG60 Summary of contents

Page 1

... DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D168 BYG60 series Fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of 1996 June 05 2000 Jul 03 ...

Page 2

... Fig.7 see Fig.3 amb half sine wave prior to surge max RRMmax 2 Product specification BYG60 series The well-defined void-free case transfer-moulded thermo-setting plastic. a Side view MSA474 MIN. MAX. UNIT 200 V 400 V 600 V ...

Page 3

... Philips Semiconductors Fast soft-recovery controlled avalanche rectifiers SYMBOL PARAMETER E non-repetitive peak reverse RSM avalanche energy BYG60D to J BYG60K and M T storage temperature stg T junction temperature j ELECTRICAL CHARACTERISTICS unless otherwise specified. j SYMBOL PARAMETER V forward voltage F V reverse avalanche (BR)R breakdown voltage ...

Page 4

... I F(AV) 200 Device mounted as shown in Fig.7. Solid line: Al Dotted line: epoxy printed-circuit board. Fig.3 MGD483 handbook, halfpage K M 800 1200 V R (V) Solid line: T Dotted line BYG60 series 1.6 (A) 1.2 0.8 0 100 T amb ( 0. 1.57. R RRMmax O printed-circuit board Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage) ...

Page 5

... Fig.8 Test circuit and reverse recovery time waveform and definition. 2000 Jul 03 MGC532 200 Dimensions in mm. Material: AL Fig (A) 0 0.25 0 (A) 1 Product specification BYG60 series 50 4.5 2.5 1.25 MSB213 O or epoxy-glass Printed-circuit board for surface mounting MAM057 ...

Page 6

... DIMENSIONS (mm are the original dimensions) A UNIT 1.6 2.3 mm 0.05 0.2 1.4 2.0 Note 1. The marking band indicates the cathode. OUTLINE VERSION IEC SOD106 2000 Jul (1) 0 2.5 scale 4.5 2.8 5.5 3.3 4.3 2.4 5.1 2.7 REFERENCES JEDEC EIAJ DO-214AC 6 Product specification BYG60 series EUROPEAN PROJECTION SOD106 ISSUE DATE 97-06-09 ...

Page 7

... Product specification BYG60 series (1) These products are not Philips Semiconductors ...

Page 8

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...

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