HSCH-9301 Avago Technologies, HSCH-9301 Datasheet - Page 3

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HSCH-9301

Manufacturer Part Number
HSCH-9301
Description
Gaas Beam Lead Schottky Ring Quad Diode
Manufacturer
Avago Technologies
Datasheet
3
Typical Parameters
Figure 1. Typical Forward Characteristics for
HSCH-9301.
Dynamic and Series Resistance
Schottky diode resistance may be
expressed as series resistance,
R
These two terms are related by
the equation
where R
junction. Junction resistance of a
diode with DC bias is quite
accurately calculated by
where I
milliamperes. The series resistance
is independent of current.
The dynamic resistance is more
easily measured. If series
resistance is specified it is
usually obtained by subtracting
the calculated junction resis-
tance from the measured
dynamic resistance.
Quad Capacitance
Capacitance of Schottky diode
quads is measured using an
HP4271 LCR meter. This
instrument effectively isolates
S
0.01
, or as dynamic resistance, R
100
0.1
10
1
0
B
+125°C
+25°C
j
-55°C
is the bias current in
0.2
is the resistance of the
FORWARD VOLTAGE (V)
R
R
D
0.4
j
= R
= 26/I
S
0.6
+ R
B
j
0.8
1.0
D
1.2
.
SPICE Parameters
Parameter
B
C
E
I
I
N
R
P
P
M
individual diode branches from the
others, allowing accurate
capacitance measurement of each
branch or each diode. The
conditions are: 20 mV R.M.S.
voltage at 1 MHz. Avago defines
this measurement as “C
equivalent to the capacitance of
the diode by itself. The equivalent
diagonal and adjacent capacitances
can then be calculated by the
formulas given below.
In a quad, the diagonal capaci-
tance is the capacitance between
points A and B as shown in
Figure 2. The diagonal
capacitance is calculated using
the following formula
C
Figure 2.
C
BV
S
G
J0
S
B
T
V
DIAGONAL
C
C
= ––––––– + –––––––
1
2
Units
V
pF
eV
A
A
V
C
C
1
1
x C
+ C
2
2
HSCH-9301
5
0.04
1.43
10E-5
1.6 x 10E-13
1.20
5
0.7
2
0.5
C
M
C
3
,” and it is
4
C
C
3
3
x C
+ C
4
4
A
B
The equivalent capacitance is the
capacitance between points A
and C in Figure 2. This
capacitance is calculated using
the following formula
Assembly Techniques
Diodes are ESD sensitive. ESD
preventive measures must be
employed in all aspects of
storage, handling, and assembly.
Diode ESD precautions, handling
considerations, and bonding
methods are critical factors in
successful diode performance
and reliability.
Avago application note #55,
“Beam Lead Diode Bonding and
Handling Procedures” provides
basic information on these
subjects.
C
ADJACENT
= C
1
+ ––––––––––
–– + –– + ––
C
1
2
C
1
1
3
C
1
4

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