BD7561G ROHM Co. Ltd., BD7561G Datasheet - Page 16

• Manufacturer Part Number: BD7561G
• Description: High Voltage Operation Cmos Operational Amplifiers Input/output Full Swing
• Manufacturer: ROHM Co. Ltd.

BD7561G,BD7561SG,BD7541G,BD7541SG,
BD7562F/FVM,BD7562SF/FVM, BD7542F/FVM,BD7542SF/FVM
●Derating curve
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2.11 Slew rate (SR)
2.12 Unity gain frequency (ft)
2.13 Total harmonic distortion + Noise (THD＋N)
2.14 Input referred noise voltage (Vn)
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).
IC is heatedwhen it consumed power, and the temperature of IC ship becomes higher than ambient temperature.
The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and
thermal resistance of package (heat dissipation capability).
The maximum junction temperature is typically equal to the maximum value in the storage package (heat dissipation capability).
The maximum junction temperature is typically equal to the maximum value in the storage temperature range.
Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package.
The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented
by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this thermal resistance.
Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction
temperature Tj, and power dissipation Pd can be calculated by the equation below :
Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature.
Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by
thermal resistance θja.
Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind
velocity, etc even when the same of package is used.
Thermal reduction curve indicates a reference value measured at a specified condition. Fig99(c)-(f) show a derating curve
for an example of BU7561family, BU7562family, 7541family, 7542family.
Indicates the time fluctuation ratio of voltage output when step input signal is applied.
Indicates a frequency where the voltage gain of Op-Amp is 1.
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series
with input terminal.
Chip surface temperature Tj [℃]
Power dissipation P [W]
θja ＝ (Tj － Ta) / Pd [ ℃ /W]
(a) Thermal resistance
Ambient temperature Ta [℃]
チップ表面温度 Tj[ ℃ ]
θja ＝ (Tj-Ta) / Pd
周囲温度 Ta[ ℃ ]
消費電力 P[W]
パッケージ表面温度 Ta[ ℃ ]
Package surface temperature [℃]
Fig. 98. Thermal resistance and derating
[℃/W]
16/20
Power dissipation of LSI [W]
・・・・・ (Ⅰ)
Ambient temperature Ta [℃]
LSI の消費電力 [W]
P2
P1
0
周囲温度 Ta[ ℃ ]
Pd(max)
25
(b) Derating curve
50
θja1
75
BD7561/BD7541
Tj(max)
θja2 <θja1
100
θja2
Technical Note
2009.05 - Rev.A
125
Tj(max)
150