BUB STMicroelectronics, BUB Datasheet - Page 7

• Manufacturer Part Number: BUB
• Description: Transil
• Manufacturer: STMicroelectronics

Package mechanical data SMB (plastic)
3
Table 3.
7/9
Figure 9.
Dimensions
E1
E
Footprint dimensions (millimeter)
Package mechanical data SMB (plastic)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
1.75
L
1.75
5.25
c
D
1.75
A1
A2
2.22
b
Ref.
Figure 10. Marking
A1
A2
E1
E
D
b
L
c
SMBJ5.0A-TR, CA-TR, SMBJ188A-TR, CA-TR
x x x
z
Min.
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
Cathode bar ( unidirectional devices only )
y w w
Millimeters
Typ.
2.15
0.15
5.40
4.30
3.60
1.15
e3
Max.
2.45
0.20
2.20
0.41
5.60
4.60
3.95
1.60
Dimensions
E : ECOPACK ( Leadfree ) mention
XXX : Marking
Z : Manufacturing location
Y : Year
WW : week
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
Min.
Inches
0.085
0.006
0.213
0.169
0.142
0.045
Typ.
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.063
Max.