NSL35TT1 ON Semiconductor, NSL35TT1 Datasheet

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NSL35TT1

Manufacturer Part Number
NSL35TT1
Description
High Current Surface Mount Pnp Transistor Silicon Low Vce Sat Transistor For Battery Operated Applications
Manufacturer
ON Semiconductor
Datasheet
NSL35TT1
High Current Surface
Mount PNP Silicon
Low V
for Battery Operated
Applications
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 X 1.0 inch Pad
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 3
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current − Peak
Collector Current
Electrostatic Discharge
Total Device Dissipation
Thermal Resistance,
Total Device Dissipation
Thermal Resistance,
Thermal Resistance,
Junction and Storage
T
Derate above 25°C
Junction to Ambient
T
Derate above 25°C
Junction to Ambient
Junction to Lead #3
Temperature Range
A
A
= 25°C
= 25°C
Characteristic
Rating
CE(sat)
− Continuous
(T
A
= 25°C)
Transistor
R
R
P
P
θJA
θJA
D
D
Symbol
Symbol
T
V
V
V
(Note 1)
(Note 2)
ESD
R
J
(Note 1)
(Note 2)
CEO
CBO
EBO
, T
I
θJL
C
stg
−55 to
−500
+150
Max
−5.0
−1.0
HBM Class 3B
Max
−35
−50
210
595
365
340
205
1.7
2.9
MM Class C
1
mW/°C
mW/°C
mAdc
°C/W
°C/W
°C/W
Unit
Unit
Vdc
Vdc
Vdc
Adc
mW
mW
°C
NSL35TT1
Device
ORDERING INFORMATION
PNP TRANSISTOR
L1 = Specific Device Code
BASE
DEVICE MARKING
http://onsemi.com
1
SOT−416/SC−75
35 VOLTS
1.0 AMPS
SOT−416
Package
CASE 463
COLLECTOR
STYLE 1
3
EMITTER
L1
1
Publication Order Number:
3
2
2
3000/Tape & Reel
Shipping
NSL35TT1/D

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NSL35TT1 Summary of contents

Page 1

... J stg +150 1 http://onsemi.com 35 VOLTS 1.0 AMPS PNP TRANSISTOR COLLECTOR 3 1 BASE 2 EMITTER CASE 463 SOT−416/SC−75 STYLE 1 DEVICE MARKING Specific Device Code ORDERING INFORMATION Device Package Shipping NSL35TT1 SOT−416 3000/Tape & Reel Publication Order Number: NSL35TT1/D ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (I = −10 mAdc Collector −Base Breakdown Voltage (I = −0.1 mAdc Emitter −Base Breakdown Voltage (I = −0.1 mAdc, I ...

Page 3

200 0.01 0.001 0.001 0. COLLECTOR CURRENT (AMPS) C Figure 1. Collector Emitter Saturation Voltage vs. Collector Current 500 125°C 400 300 25°C 200 T = −55°C A ...

Page 4

−55°C 0.8 25°C 0 125°C A 0.4 0.2 0 0.001 0. COLLECTOR CURRENT (AMPS) C Figure 7. Base Emitter Turn−On Voltage vs. Collector Current ...

Page 5

INFORMATION FOR USING THE SOT−416 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure ...

Page 6

Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of ...

Page 7

... BSC 0.039 BSC H −−− 0.10 −−− 0.004 J 0.10 0.25 0.004 0.010 K 1.45 1.75 0.057 0.069 L 0.10 0.20 0.004 0.008 S 0.50 BSC 0.020 BSC STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NSL35TT1/D ...

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