NJL5901AR New Japan Radio Co.,Ltd, NJL5901AR Datasheet - Page 6

• Manufacturer Part Number: NJL5901AR
• Description: Njl5901ar Cobp Photo Reflector
• Manufacturer: New Japan Radio Co.,Ltd

1. Soldering to actual circuit board
2. Cleaning
3. Attention in handling
4. Storage
16-Feb-07
Room
Temp.
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc.
3) Never to apply reverse voltage (V
4) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
Avoid washing the device after soldering by reflow method.
Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the moisture at
the reflow process, the device is contained in deaeration packaging.
260°C
230°C
220°C
180°C
150°C
Soldering condition
Soldering Method
1) Reflow Method
2) Reflow Method (In case of infrared heating)
3) The other method
Solder the device in short time as soon as possible.
If the device is heated and kept in high temperature for longer time, its reliability would be affected.
The surface temperature of plastic package is lower than 260 °C.
adjusting the system. If applied, it causes to lower the sensitivity.
important to place the device to the optimum position to the object.
The temperature profile is same as the above
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its surface
temperature will be higher than the lead.
Soldering to be done within twice under the recommended condition mentioned below
a
b
EC
PRECAUTION FOR HANDLING
) of more than 6V on the photo transistor when measuring the characteristics or
c
f
e
d
g
a : Temperature ramping rate
b : Pre-heating temperature
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
g : Temperature ramping rate
The temperature of the surface of mold package
time
NJL5901AR
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
: Lower than 260°C
: 1 to 6°C /s
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