BUJ302A NXP Semiconductors, BUJ302A Datasheet
BUJ302A
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BUJ302A Summary of contents
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... Junction to ambient th j-a August 1998 CONDITIONS ˚ 1.0 A Ic=1A,I =0.2A B1 PIN CONFIGURATION tab CONDITIONS ˚C mb CONDITIONS in free air 1 Objective specification BUJ302A TYP. MAX. UNIT - 1000 V - 1000 V - 500 1.0 V 145 160 ns SYMBOL MIN ...
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... CONDITIONS Con Bon Boff ohms BB2 Con Bon - 1 0 Con Bon - 100 ˚ Objective specification BUJ302A MIN. TYP. MAX. UNIT - - 0 1 500 - - 1 1 TYP ...
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... Dimensions in mm Net Mass 3,0 max not tinned 1,3 max (2x) Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". August 1998 10,3 max 1,3 3,7 2,8 3,0 13,5 min 0,9 max (3x) 2,54 2,54 Fig.1. TO220AB; pin 2 connected to mounting base. 3 Objective specification BUJ302A 4,5 max 5,9 min 15,8 max 0,6 2,4 Rev 1.000 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1998 Objective specification 4 BUJ302A Rev 1.000 ...