HVC359 Renesas Electronics Corporation., HVC359 Datasheet
HVC359
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HVC359 Summary of contents
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To our customers, Old Company Name in Catalogs and Other Documents st On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the ...
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm ...
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... Features • High capacitance ratio and good C-V linearity. • usable at low voltage. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Type No. HVC359 Pin Arrangement Rev.3.00 Jan 17, 2005 page Laser Mark S Cathode mark Mark 1 ...
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Absolute Maximum Ratings Item Reverse voltage Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current Capacitance Capacitance ratio n Series resistance ESD-Capability * ≥ ...
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Main Characteristic Rev.3.00 Jan 17, 2005 page –9 10 –10 10 –11 10 –12 10 – Reverse voltage V R Fig.1 Reverse Current vs. Reverse Voltage ...
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Package Dimensions Rev.3.00 Jan 17, 2005 page 1.2 ± 0.10 1.6 ± 0.10 Package Code JEDEC JEITA Mass (reference value January, 2003 Unit: mm UFP — Conforms 0.0016 g ...
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Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...