IR3505M International Rectifier Corp., IR3505M Datasheet - Page 17

• Manufacturer Part Number: IR3505M
• Description: Xphase3 Phase Ic
• Manufacturer: International Rectifier Corp.

Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
• The minimum solder resist width is 0.13mm.
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
• The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
a fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment.
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
Page 17 of 19
In 0.5mm pitch cases it is
Sept 26
IR3505
th
, 2007