MCP23S18 Microchip Technology, MCP23S18 Datasheet - Page 53

• Manufacturer Part Number: MCP23S18
• Description: 16-Bit I/O Expander
• Manufacturer: Microchip Technology

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PRODUCT IDENTIFICATION SYSTEM
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© 2008 Microchip Technology Inc.
PART NO.
Device
Temperature
Range
Package
Device
Temperature
–
Range
MCP23018T:
MCP23S18:
MCP23S18T:
E
MJ
SP
SO
SS
MCP23018:
X
= -40°C to +125°C (Extended) *
= Plastic Quad Flat, No Lead Package
= Skinny Plastic DIP (300 mil Body), 28-Lead
= Plastic SOIC (300 mil Body), 28-Lead
= SSOP, (209 mil Body, 5.30 mm), 24-Lead
(4x4x0.9 mm Body), 24-Lead
Package
/XX
16-Bit I/O Expander w/ I
face
16-Bit I/O Expander w/ I
(Tape and Reel)
16-Bit I/O Expander w/ SPI Interface
16-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
2
2
C™ Inter-
C Interface
MCP23018/MCP23S18
Examples:
a)
b)
c)
d)
e)
f)
a)
b)
c)
d)
MCP23018-E/SP:
MCP23018-E/SO: Extended Temp.,
MCP23018T-E/SO: Tape and Reel,
MCP23018-E/SS:
MCP23018T-E/SS: Tape and Reel,
MCP23018-E/MJ:
MCP23S18-E/SP: Extended Temp.,
MCP23S18-E/SO: Extended Temp.,
MCP23S18T-E/SO: Tape and Reel,
MCP23S18T-E/MJ: Tape and Reel,
.
Extended Temp.,
28LD SPDIP package.
28LD SOIC package.
Extended Temp.,
28LD SOIC package.
Extended Temp.,
24LD SSOP package.
Extended Temp.,
24LD SSOP package.
Extended Temp.,
24LD QFN package.
28LD SPDIP package.
28LD SOIC package.
Extended Temp.,
28LD SOIC package.
Extended Temp.,
24LD QFN package.
DS22103A-page 53