LX8610 Microsemi Corporation, LX8610 Datasheet - Page 2

• Manufacturer Part Number: LX8610
• Description: 1a Bicmos Very Low Dropout Regulators
• Manufacturer: Microsemi Corporation

Copyright
Rev. 0.6f,2000-09-15
A
M I C R O S E M I
Input Voltage (V
Enable Pin ..............................................................................................-0.3V to V
Operating Junction Temperature Plastic (ST & DM) Packages .................................125°C
Storage Temperature ................................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ...............................................................300°C
Note:
Junction Temperature Calculation: T
The
system. All of the above assume no ambient airflow.
internal power plane
technique. See table below for thermal resistance guidelines
JA
0.25 sq” (161 mm
0.25 sq” (161 mm
*Tab of device attached to topside copper, or leads 2,3,5,6 of SOIC package
2.0 sq” (1290mm
2.0 sq” (1290mm
1.0 sq” (645 mm
0.5 sq” (323 mm
1.0 sq” (645 mm
0.5 sq” (323 mm
THERMAL RESISTANCE-JUNCTION TO TAB,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE
THERMAL RESISTANCE
Copper Area
DM
can be improved with package soldered copper area over backside ground plane or
ST
(Topside)*
2000
JA
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
numbers are guidelines for the thermal performance of the device/pc-board
P
P


LASTIC
LASTIC
IN
                
                   
) ......................................................................................................6.5V

2
2
2
2
2
2
2
2
)
)
)
)
.
)
)
)
)
SOT-223 P
SOIC P
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
JA
1.0 sq” (645 mm
0.5 sq” (323 mm
1.0 sq” (645 mm
0.5 sq” (323 mm
can vary from 45°C/W > 75°C/W depending on mounting
0.1 sq” (65 mm
0.1 sq” (65 mm
0.1 sq” (65 mm
0.1 sq” (65 mm
Copper Area
(Backside)*
ACKAGE
      
  
      
  
-
-
C O M P A N Y
JUNCTION TO AMBIENT
JUNCTION TO AMBIENT
ACKAGE
J
ST (SOT-223)
= T
DM (SOIC)
A
2
2
2
2
+ (P
2
2
2
2
)
)
)
)
)
)
)
)
D
Linfinity Microelectronics Division
x
0.25 sq” (161 mm
0.25 sq” (161 mm
2.0 sq” (1290mm
2.0 sq” (1290mm
1.0 sq” (645 mm
0.5 sq” (323 mm
1.0 sq” (645 mm
0.5 sq” (323 mm
JA
Board Area
).

Microsemi
JT
:
  
,
,
JA
JLD
JA
1A BiCMOS Very Low Dropout Regulators
2
2
2
2
2
2
2
2
)
)
)
)
)
)
)
)
Resistance
Thermal
150 C/W
45°C/W
50°C/W
60°C/W
70°C/W
60°C/W
67°C/W
70°C/W
75°C/W
30°C/W
90°C/W
15 C/W*
(
IN
JA)
+0.3V
P
RELIMINARY
   
   
Possible Heat Sink Approaches
H E A T S IN K
H E A T S IN K
D
E N A B LE
G N D /
G N D /
ATASHEET
   
   
V
O UT
using PCB Copper
DM PACKAGE
ST PACKAGE
(Top View)
(Top View)
T A B IS G N D
1
2
3
4
1
2
3
4
LX8610-xx
3
2
1
8
7
6
5
8
7
6
5
A D J
H E A T S IN K
H E A T S IN K
V
V
G N D
V
IN
OU T
IN
G N D /
G N D /
Page 2