FAN3224 Fairchild Semiconductor, FAN3224 Datasheet - Page 2

• Manufacturer Part Number: FAN3224
• Description: Dual 4A High-speed, Low-side Gate Drivers
• Manufacturer: Fairchild Semiconductor

© 2007 Fairchild Semiconductor Corporation
FAN3223 / FAN3224 / FAN3225 • Rev. 1.0.5
Ordering Information
FAN3223CMPX
FAN3223CMX
FAN3223TMPX
FAN3223TMX
FAN3224CMPX
FAN3224CMX
FAN3224TMPX
FAN3224TMX
FAN3225CMPX
FAN3225CMX
FAN3225TMPX
FAN3225TMX
definition of “green” please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outlines
Thermal Characteristics
8-Lead 3x3mm Molded Leadless Package (MLP)
8-Pin Small Outline Integrated Circuit (SOIC)
Notes:
1.
2.
3.
4.
5.
6.
Part Number
All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL (
thermal pad) that are typically soldered to a PCB.
Theta_JT (
held at a uniform temperature by a top-side heatsink.
Theta_JA (Θ
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
Psi_JB (
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
Psi_JT (
the center of the top of the package for the thermal environment defined in Note 4.
Figure 2. 3x3mm MLP-8 (Top View)
Ψ
Ψ
JT
JB
Θ
Θ
): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
JL
JT
JA
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
Dual Inverting Channels + Dual Enable
Dual Non-Inverting Channels + Dual
Enable
Dual Channels of Two-Input / One-
Output Drivers
Package
Logic
(1)
2
Threshold
CMOS
CMOS
CMOS
Input
Θ
TTL
TTL
TTL
1.2
38
JL
(2)
Figure 3. SOIC-8 (Top View)
Θ
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
JT
64
29
(3)
Package
Θ
JA
42
87
(4)
Ψ
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
2.8
41
JB
Packing
Method
(5)
Ψ
0.7
2.3
JT
(6)
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Quantity
per Reel
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
Units
°C/W
°C/W