LM2750LD-5.0 National Semiconductor, LM2750LD-5.0 Datasheet - Page 4

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LM2750LD-5.0

Manufacturer Part Number
LM2750LD-5.0
Description
Low Noise/ 5.0V Regulated Switched Capacitor Voltage Converter
Manufacturer
National Semiconductor
Datasheet

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Electrical Characteristics
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Thermal shutdown circuitry protects the device from permanent damage.
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 5: Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
equation: P
I
The maximum ambient temperature rating of 85
V
20mW above 727mW (again assuming that θ
Leadframe Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet.
Note 6: Junction-to-ambient thermal resistance (θ
standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array of thermal vias. The ground plane on the board
is 50mm x 50mm. Thickness of copper layers are 36mm/18 mm /18 mm /36 mm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22˚C, still air. Power
dissipation is 1W.
The value of θ
conditions. In applications where high maximum power dissipation exists (high V
information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation
section of this datasheet. and the following sections of this datasheet:
Note 7: All room temperature limits are 100% tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed by correlation
using standard Statistical Quality Control methods (SQC). All limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are not
guaranteed, but do represent the most likely norm.
Note 8: C
Note 9: Turn-on time is measured from when SD signal is pulled high until the output voltage crosses 90% of its final value.
Note 10: Efficiency is measured versus V
results. Weighting to account for battery voltage discharge characteristics (V
Note 11: SD Input Current (I
Note 12: Limit is the minimum required output capacitance to ensure proper operation. This electrical specification is guaranteed by design.
Block Diagram
OUT-MAX
IN-MAX
= 5.5V and I
are the maximum voltage/current of the specific application, and not necessarily the maximum rating of the LM2750.
FLY
D-MAX
, C
JA
of the LM2750 in LLP-10 could fall in a range as wide as 50
IN
= (V
, and C
A-MAX
OUT-MAX
IN-MAX
OUT
= T
IH
x I
= 115mA, for example). Maximum ambient temperature must be derated by 1.1
J-MAX-OP
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
) is due to a 200kΩ (typ.) pull-down resistor connected internally between the SD pin and GND.
IN-MAX
) - (V
- (θ
IN
JA
A-MAX
JA
OUT
, with V
D-MAX
x P
= 55
D-MAX
o
x I
) is dependent on the maximum operating junction temperature (T
C is determined under the following application conditions: θ
JA
o
), and the junction-to ambient thermal resistance of the part/package in the application (θ
OUT-MAX
C/W in the application). For more information on these topics, please refer to Application Note 1187: Leadless
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
IN
). Maximum power dissipation of the LM2750 in a given application can be approximated using the following
being swept in small increments from 3.0V to 4.2V. The average is calculated from these measurements
(Notes 2, 7) (Continued)
) = [V
IN-MAX
x ((2 x I
o
C/W to 150
BAT
4
vs. Time) is not done in computing the average.
IN
OUT-MAX
, high I
o
C/W (if not wider), depending on PCB material, layout, and environmental
OUT
) + 5mA)] - (V
), special care must be paid to thermal dissipation issues. For more
OUT
x I
o
C for every increase in internal power dissipation of
OUT-MAX
JA
= 55
J-MAX-OP
o
). In this equation, V
C/W, P
D-MAX
= 125
20035103
= 727mW (achieved when
o
C), the maximum power
IN-MAX
JA
), as given by the
, I
IN-MAX
, and

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