STM1645-30 ST Microelectronics, Inc., STM1645-30 Datasheet - Page 4
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STM1645-30
Manufacturer Part Number
STM1645-30
Description
RF Power Module Satellite Communications Applications
Manufacturer
ST Microelectronics, Inc.
Datasheet
1.STM1645-30.pdf
(6 pages)
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STM1645-30
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM1645-30 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum
ratings. If the module is to be subjected to one or
more of the maximum rating conditions, care
must be taken to monitor other parameters which
may be affected.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within 0.05 mm ( 0.002 Inch)
The module should be mounted to the heatsink
using 3.5 mm (or 6-32) or equivalent screws
torqued to 5-6 Kg-cm (4-6 in-lb).
4/6
The module leads should be attached to
equipment PC board using 180
to leads with a properly grounded soldering iron
tip, not to exceed 195
mm (0.080 inch) from the body of the module for
a duration not to exceed 15 seconds per lead. It
is imperative that no other portion of the module,
other than the leads, be subjected to temperature
in
temperature), for any period of time, as the
plastic moulded cover, internal components and
sealing adhesives may be advertisely affected by
such conditions.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flange heatsink or leads, is not recommended.
excess of
100
o
C, applied a minimum of 2
o
C
(maximum storage
o
C solder applied