TS615 ST Microelectronics, Inc., TS615 Datasheet - Page 18

• Manufacturer Part Number: TS615
• Description: Dual Wide Band Operational Amplifier
• Manufacturer: ST Microelectronics, Inc.

TS615
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
In this range of frequency, printed circuit board
parasites can affect the closed-loop performance.
The implementation of a proper ground plane in
both sides of the PCB is mandatory to provide low
inductance and low resistance common return.
Most important for controlling the gain flatness
and the bandwidth are stray capacitances at the
output and inverting input. For minimizing the cou-
pling, the space between signal lines and ground
plane will be increased. Connections of the feed-
back components must be as short as possible in
order to decrease the associated inductance
which affect high frequency gain errors. It is very
important to choose external components as small
as possible such as surface mounted devices,
SMD, in order to minimize the size of all the DC
and AC connections.
THERMAL INFORMATION
The TS615 is housed in an Exposed-Pad plastic
package. As described on the figure 56, this pack-
age uses a lead frame upon which the dice is
mounted. This lead frame is exposed as a thermal
pad on the underside of the package. The thermal
contact is direct with the dice. This thermal path
provide an excellent thermal performance.
The thermal pad is electrically isolated from all
pins in the package. It should be soldered to a
copper area of the PCB underneath the package.
Through these thermal paths within this copper ar-
ea, heat can be conducted away from the pack-
age. In this case, the copper area should be con-
nected to (-
18/27
V
CC
).
Figure 55 : Exposed-Pad Package
Figure 56 : Evaluation Board
Side View
Side View
Cross Section View
Cross Section View
Bottom View
Bottom View
DICE
DICE
1
1