MT29C1G12MAVRACA-75IT Micron Technology, MT29C1G12MAVRACA-75IT Datasheet

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MT29C1G12MAVRACA-75IT

Manufacturer Part Number
MT29C1G12MAVRACA-75IT
Description
NAND Flash and Mobile LPDRAM
Manufacturer
Micron Technology
Datasheet
NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP)
Combination Memory (TI OMAP™)
MT29C Family
Current production part numbers: See Table 1 on page 3
Features
• Micron
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM
• Space-saving package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C
NAND Flash-Specific Features
• Organization
Mobile LPDRAM-Specific Features
• No external voltage reference required
• No minimum clock rate requirement
• 1.8V LVCMOS-compatible inputs
• Programmable burst lengths
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• STATUS REGISTER READ (SRR) supported
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
– Page size
– Block size: 64 pages (128K + 4K bytes)
components
interfaces
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
®
NAND Flash and Mobile LPDRAM
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
1
1
www.DataSheet.net/
Figure 1:
Notes: 1. Contact factory for remapped SRR output.
Options
• LP-DRAM
NAND Flash
Power
LP-DRAM Power
166 MHz CL3
133 MHz CL3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. CL = CAS (READ) latency.
PoP Block Diagram
2
NAND Flash
LP-DRAM
Device
Device
©2008 Micron Technology, Inc. All rights reserved.
LP-DRAM Interface
NAND Flash
Interface
Preliminary
Marking
Features
-75
-6
Datasheet pdf - http://www.DataSheet4U.co.kr/

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MT29C1G12MAVRACA-75IT Summary of contents

Page 1

... Options • LP-DRAM 2 166 MHz CL3 1 133 MHz CL3 Notes: 1. Contact factory for remapped SRR output CAS (READ) latency. Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 ‡ Preliminary Features NAND Flash Device Interface LP-DRAM Device ...

Page 2

... First x32 1Gb First x16 512Mb Second x32 512Mb Second Micron Technology, Inc., reserves the right to change products or specifications without notice. 2 Preliminary ES Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Operating Temperature Range IT = Industrial (–40° to +85°C) LPDRAM Self Refresh Current ...

Page 3

... MT29C2G24MAKLACG-75 IT MT29C1G12MAURACA-6 IT MT29C1G12MAURACA-75 IT MT29C1G12MAVRACA-6 IT MT29C1G12MAVRACA-75 IT Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanu- meric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www ...

Page 4

... PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN General Description is tied together on the two devices). SS www.micron.com/products/nand, www.micron.com/products/mobiledram, www.DataSheet.net/ Micron Technology, Inc., reserves the right to change products or specifications without notice. 4 ©2008 Micron Technology, Inc. All rights reserved. Preliminary or con- or Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 5

... CE0# ALE CLE Top View – Ball Down Micron Technology, Inc., reserves the right to change products or specifications without notice. 5 Preliminary DQ12 DQ13 DDQ DQ15 DQ14 NC NC ...

Page 6

... CKE1 CE0# ALE CLE Top View (Ball Down) Micron Technology, Inc., reserves the right to change products or specifications without notice. 6 Preliminary DQ20 DM3 DQS3 DQ21 DDQ DQ23 DQ22 DQ28 NC NC ...

Page 7

... Rev. E 4/09 EN Ball Assignments and Descriptions Description during power-up, or leave it unconnected (internal pull-down for NAND x8 devices. www.DataSheet.net/ Micron Technology, Inc., reserves the right to change products or specifications without notice. 7 Preliminary ©2008 Micron Technology, Inc. All rights reserved. Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 8

... Contact the factory for details. PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN Ball Assignments and Descriptions Description www.DataSheet.net/ exceeds 85°C. J Description Micron Technology, Inc., reserves the right to change products or specifications without notice. 8 ©2008 Micron Technology, Inc. All rights reserved. Preliminary Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 9

... V DDQ – Symbol DDQ – www.DataSheet.net/ Micron Technology, Inc., reserves the right to change products or specifications without notice. 9 Preliminary Electrical Specifications Min Max Unit –1.0 2.4 1 –0.5 2.4 or (supply voltage + 0.3V), whichever is less –55 +150 . DDQ Min Typ Max Unit 1 ...

Page 10

... CKE0 RAS# CAS# WE# Address, BA0, BA1 PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN NAND Flash LPDDR www.DataSheet.net/ Micron Technology, Inc., reserves the right to change products or specifications without notice. 10 ©2008 Micron Technology, Inc. All rights reserved. Preliminary Device Diagrams V CC I/O R/ ...

Page 11

... CAS# WE# Address, BA0, BA1 PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN CE0# CLE ALE NAND Flash RE# CK LPDDR (Die 0 and 1) www.DataSheet.net/ Micron Technology, Inc., reserves the right to change products or specifications without notice. 11 Preliminary Device Diagrams V CC I/O R/ DDQ DQM ...

Page 12

... www.DataSheet.net 0.65 TYP 0.9 MAX 0.35 MIN Micron Technology, Inc., reserves the right to change products or specifications without notice. 12 Preliminary Package Dimensions Ball A1 ID ©2008 Micron Technology, Inc. All rights reserved. Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 13

... Ball ±0 www.DataSheet.net 0.65 TYP 0.35 MIN Micron Technology, Inc., reserves the right to change products or specifications without notice. 13 Preliminary Package Dimensions Ball A1 ID 1.0 MAX ©2008 Micron Technology, Inc. All rights reserved. Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 14

... Ball ±0 www.DataSheet.net 0.65 TYP 0.35 MIN devices. Micron Technology, Inc., reserves the right to change products or specifications without notice. 14 Preliminary Package Dimensions Ball A1 ID 1.1 MAX ©2008 Micron Technology, Inc. All rights reserved. Datasheet pdf - http://www.DataSheet4U.co.kr/ ...

Page 15

... Rev. A, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/08 • Initial release. PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev Micron Technology, Inc., reserves the right to change products or specifications without notice. 15 ©2008 Micron Technology, Inc. All rights reserved. Preliminary Revision History ...

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