SSTUA32866 Philips Semiconductors, SSTUA32866 Datasheet - Page 25

• Manufacturer Part Number: SSTUA32866
• Description: configurable registered buffer
• Manufacturer: Philips Semiconductors

Philips Semiconductors
14. Abbreviations
15. Revision history
Table 13:
9397 750 14759
Product data sheet
Document ID
SSTUA32866_1
Revision history
Release date
20050715
[4]
[5]
[6]
[7]
[8]
[9]
Table 12:
Acronym
CMOS
DDR
DIMM
LVCMOS
PPO
PRR
RDIMM
SSTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Complementary Metal Oxide Silicon
Double Data Rate
Dual In-line Memory Module
Low Voltage Complementary Metal Oxide Silicon
Partial Parity Out
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 01 — 15 July 2005
1.8 V DDR2-667 configurable registered buffer with parity
Change notice
-
Doc. number
9397 750 14759
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUA32866
Supersedes
-
25 of 27