SI4012 Silicon Laboratories, SI4012 Datasheet - Page 15

• Manufacturer Part Number: SI4012
• Description: CRYSTAL-LESS RF TRANSMITTER
• Manufacturer: Silicon Laboratories

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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ASME Y14.5M-1994.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC).
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Dimension
Least Material Condition (LMC) is calculated based on a Fabrication
Allowance of 0.05 mm.
between the solder mask and the metal pad is to be 60 µm minimum,
all the way around the pad.
trapezoidal walls should be used to assure good solder paste release.
020 specification for Small Body Components.
Table 9. 10-Pin MSOP Package Dimensions
G1
C1
X1
Y1
Z1
E
Rev 0.1
3.00
MIN
—
—
4.40 REF
0.50 BSC
1.40 REF
MAX
0.30
5.80
—
Si4012
15
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