EGF1 Vishay Intertechnology, EGF1 Datasheet
EGF1
Manufacturer Part Number
EGF1
Description
Manufacturer
Vishay Intertechnology
Datasheet
1.EGF1.pdf
(2 pages)
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Document Number 88579
18-Mar-02
Maximum Ratings & Thermal Characteristics
Parameter
Device Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Typical thermal resistance
(Note 1)
Operating junction and storage temperature range
Electrical Characteristics
Parameter
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time at I
Typical junction capacitance at 4V, 1MHz
Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
Mechanical Data
Case: JEDEC DO-214BA, molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.0048 oz., 0.120 g
0.030 (0.76)
0.060 (1.52)
0.118 (3.00)
0.100 (2.54)
0.066 (1.68)
0.040 (1.02)
DO-214BA (GF1)
0.167 (4.24)
0.187 (4.75)
0.196 (4.98)
0.226 (5.74)
0.006 (0.152) TYP.
0.0065 (0.17)
0.015 (0.38)
F
=0.5A, I
Ultrafast Surface Mount Glass
R
=1.0A, I
T
T
Ratings at 25°C ambient temperature unless otherwise specified.
A
A
brazed-lead assembly by Patent No. 3,930,306
Passivated Rectifier
=25°C
=125°C
and lead forming by Patent No. 5,151,846
0.094 (2.39)
*
0.114 (2.90)
Dimensions in inches and (millimeters)
L
Glass-plastic encapsulation technique
is covered by Patent No. 3,996,602,
= 125°C
rr
=0.25A
0.098 (2.49)
Symbol
Symbol
0.108 (2.74)
T
V
V
I
R
J
R
I
V
F(AV)
,T
FSM
RRM
RMS
C
V
I
t
DC
R
rr
STG
J
JA
JL
F
Features
• Plastic package has Underwriters Laboratories
• Ideal for surface mount automotive applications
• High temperature metallurgically bonded construction
• Superfast recovery times for high efficiency
• Cavity-free glass passivated junction
• Built-in strain relief • Easy pick and place
• High temperature soldering guaranteed:
• Complete device submersible temperature of 265°C for
Flammability Classification 94V-0
450°C/5 seconds at terminals.
10 seconds in solder bath
EGF1A
EGF1A
EA
50
35
50
Ratings at 25°C ambient temperature unless otherwise specified.
EGF1B
EGF1B
100
100
EB
70
–65 to +175
(1.32 MIN.)
0.052 MIN.
0.066 MIN.
(1.68 MIN.)
Vishay Semiconductors
formerly General Semiconductor
1.0
1.0
5.0
30
85
30
50
15
50
EGF1A thru EGF1D
Mounting Pad Layout
EGF1C
EGF1C
150
105
150
EC
Reverse Voltage 50 to 200V
(5.58) REF
Forward Current 1.0A
0.220
EGF1D
EGF1D
200
140
200
ED
(2.38 MAX.)
0.094 MAX.
www.vishay.com
°C/W
Unit
Unit
°C
pF
ns
V
V
V
A
A
V
A
1
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EGF1 Summary of contents
Page 1
... =125°C A =1.0A, I =0.25A EGF1A thru EGF1D Vishay Semiconductors formerly General Semiconductor Reverse Voltage 50 to 200V Forward Current 1.0A Mounting Pad Layout 0.066 MIN. 0.094 MAX. (1.68 MIN.) (2.38 MAX.) 0.052 MIN. (1.32 MIN.) 0.220 (5.58) REF EGF1B EGF1C ...
Page 2
... EGF1A thru EGF1D Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (T = 25°C unless otherwise noted) A Fig. 1 – Maximum Forward Current Derating Curve 1.0 0.5 Resistive or Inductive Load P.C.B. Mounted on 0.2 x 0.2" (5.0 x 5.0mm) Copper Pad Areas 100 Lead Temperature ( C) Fig. 3 – Typical Instantaneous ...