SKY77154 Skyworks Solutions, SKY77154 Datasheet - Page 10

• Manufacturer Part Number: SKY77154
• Description: System Smart PA Module
• Manufacturer: Skyworks Solutions

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DATA SHEET • SKY77154
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77154 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
10
Manufactured
Lot Number
Identifier
Package
Figure 12. SKY77154 Pin Configuration and Pin Names
VCONT
(1)
Pin 1
Sealed
RF_IN
Week
VCC1
VREF
Year
Pad layout as seen from top view looking through package.
(1)
(2)
All supply pins may be connected together at the supply.
Package underside is GROUND PAD.
November 3, 2006 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 103067A
1
2
3
4
Figure 13. Typical Case Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
YYWW MX
NNNNN.N
77154-N
GROUND PAD
(Top View)
(2)
8
5
7
6
VCC2
RF_OUT
GND
GND
Manufacturing
Part Number
Revision
Number
Country Code
(1)
103067_013
103067_012
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77154 is a Class 2 device.
Discharge (ESD) immunity level for each pin of the SKY77154
product. The numbers in
for each pin where the I-V curve between the pin and ground
starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pin begins to show any degradation on a
curve tracer.
> + 2 kV
> + 2 kV
> + 2 kV
> + 2 kV
< – 2 kV
< – 2 kV
< – 2 kV
< – 2 kV
VCONT
VCC1
RF IN
VREF
SYSTEM SMART® PAM FOR CDMA / AMPS (824–849 MHZ)
Pad layout as seen from top view looking through package.
Figure 14. ESD Sensitivity Areas (Top View)
1
2
4
3
Figure 14
GROUND PAD
Figure 14
specify the ESD threshold level
lists the Electrostatic
8
7
6
5
VCC2
> + 2 kV
< – 2 kV
RF OUT
> + 2 kV
< – 2 kV
GND
GND
103067_014