MPVZ2202 Motorola Semiconductor, MPVZ2202 Datasheet - Page 5

• Manufacturer Part Number: MPVZ2202
• Description: Temperature Compensated and Calibrated Presure Sensors
• Manufacturer: Motorola Semiconductor

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Sensors
Freescale Semiconductor
differential or gauge die in the basic chip carrier (Case 344).
A gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the gel which
isolates the die from the environment. The differential or
gauge sensor is designed to operate with positive differential
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
table below:
Figure 4
Freescale designates the two sides of the pressure sensor
The Pressure (P1) side may be identified by using the
illustrates an absolute sensing die (right) and the
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Lead Frame
Wire Bond
Figure 4. Cross-Sectional Diagram (Not to Scale)
Differential Sensing
Gel Die Coat
Element
P1
P2
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
Table 3. Pressure (P1)/Vacuum (P2) Side Identification
Table
MPVZ2202GC6T1
MPVZ2202GC7U
Die
Operating characteristics, internal reliability and
Part Number
Steel Cap
Stainless
Die Bond
Thermoplastic
Case Type
Case
482A
482C
Top with Port Attached
Top with Port Attached
Pressure (P1) Side
Identifier
MPVZ2202
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