ntd4810n ON Semiconductor, ntd4810n Datasheet

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ntd4810n

Manufacturer Part Number
ntd4810n
Description
Power Mosfet 30 V, 54 A, Single N-channel, Dpak/ipak
Manufacturer
ON Semiconductor
Datasheet

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NTD4810N
Power MOSFET
30 V, 54 A, Single N-Channel, DPAK/IPAK
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2007
August, 2007 - Rev. 3
Continuous Drain
Current (R
Power Dissipation
(R
Continuous Drain
Current (R
Power Dissipation
(R
Continuous Drain
Current (R
(Note 1)
Power Dissipation
(R
Pulsed Drain Current
Current Limited by Package
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain-to-Source Avalanche
Energy (V
L = 1.0 mH, I
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Drain-to-Source Voltage
Gate-to-Source Voltage
Low R
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These are Pb-Free Devices
CPU Power Delivery
DC-DC Converters
qJA
qJA
qJC
) (Note 1)
) (Note 2)
) (Note 1)
DS(on)
DD
qJA
qJA
qJC
L(pk)
= 24 V, V
) (Note 1)
) (Note 2)
)
to Minimize Conduction Losses
Parameter
= 14 A, R
GS
(T
t
= 10 V,
J
Steady
p
State
G
=10ms
= 25°C unless otherwise noted)
= 25 W)
T
T
T
T
T
T
T
T
T
T
T
A
A
A
A
A
A
A
A
C
C
C
= 25°C
= 85°C
= 25°C
= 25°C
= 85°C
= 25°C
= 25°C
= 25°C
= 25°C
= 85°C
= 25°C
I
Symbol
DmaxPkg
T
V
dV/dt
V
J
E
I
P
P
P
, T
DSS
DM
T
I
I
I
I
GS
D
D
D
AS
S
D
D
D
L
stg
- 55 to
Value
"20
10.8
1.28
120
175
260
8.4
2.0
8.6
6.7
6.0
30
54
42
50
45
41
98
1
Unit
V/ns
mJ
°C
°C
W
W
W
V
V
A
A
A
A
A
A
Gate
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
1
1 2
CASE 369C
(Bent Lead)
V
Drain
Drain 3
(BR)DSS
STYLE 2
30 V
DPAK
4
2
Source
3
ORDERING INFORMATION
G
Y
WW
4810N = Device Code
G
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
http://onsemi.com
Gate
15.7 mW @ 4.5 V
(Straight Lead)
10 mW @ 10 V
CASE 369AC
R
1
= Year
= Work Week
= Pb-Free Package
Drain
DS(on)
Drain
3 IPAK
1
D
4
2
Publication Order Number:
2 3
S
3
MAX
Source
4
Gate
N-Channel
(Straight Lead
CASE 369D
1
NTD4810N/D
1
Drain
Drain
DPAK)
2
IPAK
I
4
D
2
3
54 A
MAX
3
Source
4

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ntd4810n Summary of contents

Page 1

... CASE 369AC CASE 369D 3 IPAK IPAK (Straight Lead) (Straight Lead DPAK) MARKING DIAGRAMS & PIN ASSIGNMENTS 4 Drain 4 Drain Gate Drain Source Source Gate Drain Source Y = Year WW = Work Week 4810N = Device Code G = Pb-Free Package ORDERING INFORMATION Publication Order Number: NTD4810N/D ...

Page 2

... Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD4810N Parameter (T = 25°C unless otherwise noted) J Symbol Test Condition = 250 mA ...

Page 3

... Forward Diode Voltage Reverse Recovery Time Charge Time Discharge Time Reverse Recovery Time PACKAGE PARASITIC VALUES Source Inductance Drain Inductance, DPAK Drain Inductance, IPAK Gate Inductance Gate Resistance NTD4810N (T = 25°C unless otherwise noted) J Symbol Test Condition 25° ...

Page 4

... GATE-TO-SOURCE VOLTAGE (VOLTS) GS Figure 3. On-Resistance vs. Gate-to-Source Voltage 2 1.5 1.0 0.5 0 -50 - JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature NTD4810N TYPICAL PERFORMANCE CURVES 60 ≥ 0.020 T = 25°C ...

Page 5

... SINGLE PULSE T = 25° LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN-TO-SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD4810N TYPICAL PERFORMANCE CURVES 25° iss oss 1 ...

Page 6

... ORDERING INFORMATION Order Number NTD4810NT4G NTD4810N-1G NTD4810N-35G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD4810N TYPICAL PERFORMANCE CURVES 25°C 100°C 125°C 10 100 PULSE WIDTH (ms) Figure 13 ...

Page 7

... 0.13 (0.005) 0.228 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/ SEATING PLANE NTD4810N PACKAGE DIMENSIONS DPAK CASE 369C-01 ISSUE O SEATING -T- PLANE SOLDERING FOOTPRINT* 6 ...

Page 8

... BSC 2.29 BSC G H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 --- 3.93 --- STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTD4810N/D ...

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