upd17240 Renesas Electronics Corporation., upd17240 Datasheet - Page 96

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upd17240

Manufacturer Part Number
upd17240
Description
4-bit Single-chip Microcontrollers For Small General-purpose Infrared Remote Control Transmitters
Manufacturer
Renesas Electronics Corporation.
Datasheet

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17. RECOMMENDED SOLDERING CONDITIONS
following recommended conditions.
representative.
96
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
Infrared reflow
Wave soldering
Partial heating
Remark Products that have the part numbers suffixed by “-A” are lead-free products.
The µ PD17240, 17241, 17242, 17243, 17244, 17245, and 17246 should be soldered and mounted under the
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
(1) µ PD17240MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
(2) µ PD17240MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
Note
Caution Do not use different soldering methods together (except for partial heating).
µ PD17241MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17242MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17243MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17244MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17245MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17246MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
µ PD17241MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
µ PD17242MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
µ PD17243MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
µ PD17244MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
µ PD17245MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
µ PD17246MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Package peak temperature: 235°C, Time: 30 seconds max.
(at 210°C or higher), Count: Three times or less
Package peak temperature: 215°C, Time: 40 seconds max.
(at 200°C or higher), Count: Three times or less
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 260°C, Time: 60 seconds max.
(at 220°C or higher), Count: Three times or less, Exposure limit: 3 days
(after that, prebake at 125°C for 10 to 72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Table 17-1. Surface Mounting Type Soldering Conditions
µ PD17240, 17241, 17242, 17243, 17244, 17245, 17246
Soldering Conditions
Soldering Conditions
Data Sheet U15002EJ1V1DS
Note
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
Recommended Condition
Symbol
IR60-103-3

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