74lvc1g386gw NXP Semiconductors, 74lvc1g386gw Datasheet
74lvc1g386gw
Available stocks
Related parts for 74lvc1g386gw
74lvc1g386gw Summary of contents
Page 1
... HBM EIA/JESD22-A114E exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. SOT363 and SOT457 package Specified from 40 to +85 C and 40 to +125 C. 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LVC1G386GW +125 C 74LVC1G386GV +125 Description SC-88 plastic surface-mounted package; 6 leads SC-74A plastic surface-mounted package (TSOP6) ...
Page 2
... NXP Semiconductors 4. Marking Table 2. Marking Type number 74LVC1G386GW 74LVC1G386GV 5. Functional diagram Fig 1. Logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 74LVC1G386_2 Product data sheet Marking code mnb143 Fig 2. IEC logic symbol ...
Page 3
... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol A GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
Page 4
... NXP Semiconductors [2] When (Power-down mode), the output voltage can be 5 normal operation. CC [3] For SC-74 and SC-88 packages: above 87.5 C the value Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature ...
Page 5
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter I power-off leakage current OFF I supply current CC I additional supply current CC C input capacitance +125 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage ...
Page 6
... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t propagation delay see power dissipation V = GND capacitance [1] Typical values are measured the same as t and t ...
Page 7
... NXP Semiconductors Table 9. Measurement points 1. 1.95 V 0.5 2 2.7 V 0.5 2.7 V 1 3.6 V 1 5.5 V 0.5 Test data is given in Table 10. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance Z ...
Page 8
... NXP Semiconductors 13. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.10 0.8 OUTLINE VERSION IEC SOT363 Fig 7. Package outline SOT363 (SC-88) 74LVC1G386_2 Product data sheet scale ...
Page 9
... NXP Semiconductors Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT457 Fig 8. Package outline SOT457 (SC-74) 74LVC1G386_2 Product data sheet scale ...
Page 10
... Revision history Document ID Release date 74LVC1G386_2 20070903 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • In current. 74LVC1G386_1 20031104 ...
Page 11
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 12
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...