74lvth162374 Fairchild Semiconductor, 74lvth162374 Datasheet

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74lvth162374

Manufacturer Part Number
74lvth162374
Description
Low Voltage 16-bit D-type Flip-flop With 3-state Outputs And 25 ?series Resistors In The Outputs
Manufacturer
Fairchild Semiconductor
Datasheet

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© 2005 Fairchild Semiconductor Corporation
74LVTH162374GX
(Note 1)
74LVTH162374MEA
74LVTH162374MEX
74LVTH162374MTD
74LVTH162374MTX
74LVTH162374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
and 25: Series Resistors in the Outputs
General Description
The LVTH162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LVTH162374 is designed with equivalent 25
resistance in both the HIGH and LOW states of the output.
This design reduces line noise in applications such as
memory address drivers, clock drivers, and bus transceiv-
ers/transmitters.
The LVTH162374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) V
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVTH162374 is fabricated
with an advanced BiCMOS technology to achieve high
speed operation similar to 5V ABT while maintaining a low
power dissipation.
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Order Number
(Preliminary)
Package
BGA54A
Number
MS48A
MS48A
MTD48
MTD48
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBES]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBES]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
DS500355
:
series
CC
Features
Input and output interface capability to systems at
5V V
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
Live insertion/extraction permitted
Power Up/Power Down high impedance provides
glitch-free bus loading
Outputs include equivalent series resistance of 25
make external termination resistors unnecessary and
reduce overshoot and undershoot
Functionally compatible with the 74 series 16374
Latch-up performance exceeds 500 mA
ESD performance:
Human-body model
Machine model
Charged-device model
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
CC
Package Description
!
200V
!
2000V
!
1000V
June 2000
Revised June 2005
www.fairchildsemi.com
:
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74lvth162374 Summary of contents

Page 1

... Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide [TUBES] 74LVTH162374MEX MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide [TAPE and REEL] 74LVTH162374MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide [TUBES] 74LVTH162374MTX MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6 ...

Page 2

Logic Symbol Connection Diagrams Pin Assignments for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com Pin Descriptions Pin Names Description OE Output Enable Input (Active LOW Clock Pulse Input n I –I Inputs 0 15 ...

Page 3

Functional Description The LVTH162374 consists of sixteen edge-triggered flip-flops with individual D-type inputs and 3-STATE true outputs. The device is byte controlled with each byte functioning identically, but independent of the other. The control pins can be shorted together to ...

Page 4

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Current Supply Current ...

Page 5

DC Electrical Characteristics Symbol Parameter  I Power Supply Current CCZ ' I Increase in Power Supply Current CC (Note 6) Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 5: An ...

Page 6

Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide www.fairchildsemi.com Package Number BGA54A (Preliminary) 6 ...

Page 7

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A 7 www.fairchildsemi.com ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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