tda8591j NXP Semiconductors, tda8591j Datasheet

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tda8591j

Manufacturer Part Number
tda8591j
Description
4 X 44 W Into 4 Or 4 X 75 W Into 2 Quad Btl Car Radio Power Amplifier
Manufacturer
NXP Semiconductors
Datasheet

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TDA8591J
Manufacturer:
ST
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Preliminary specification
File under Integrated Circuits, IC01
DATA SHEET
TDA8591J
4
into 2
amplifier
44 W into 4
quad BTL car radio power
INTEGRATED CIRCUITS
or 4
75 W
2002 Jan 14

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tda8591j Summary of contents

Page 1

... DATA SHEET TDA8591J into 4 into 2 quad BTL car radio power amplifier Preliminary specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS 2002 Jan 14 ...

Page 2

... PCB design advice 2002 Jan into 2 15 PACKAGE OUTLINE 16 SOLDERING 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods 17 DATA SHEET STATUS 18 DEFINITIONS 19 DISCLAIMERS 2 Preliminary specification TDA8591J ...

Page 3

... The TDA8591J is a quad BTL audio power amplifier comprising four independent amplifiers in Bridge Tied Load (BTL) configuration. Each amplifier has a gain and supplies an output power (EIAJ) into a 2 load. The TDA8591J has low quiescent current and is primarily developed for car audio applications. PACKAGE DESCRIPTION 3 Preliminary specifi ...

Page 4

... kHz (RMS see Fig. (p-p); mute or ripple operating mode see Fig.29 4 Preliminary specification TDA8591J MIN. TYP. MAX. UNIT 8.0 14.4 18.0 V 120 200 290 ...

Page 5

... TDA8591J INTERFACE 8 OFFSET DETECTION PGND1 PGND2 PGND3 PGND4 Fig.1 Block diagram. 5 Preliminary specification TDA8591J 3 OUT1 5 OUT1 9 OUT2 11 OUT2 14 CHARGE CP PUMP 19 OUT3 17 OUT3 25 OUT4 23 OUT4 6 DIAGNOSTIC DIAG 26 OFFCAP 27 MGW449 GNDHS ...

Page 6

... W into 2 handbook, halfpage 6 Preliminary specification TDA8591J SGND 2 OUT1 3 PGND1 4 OUT1 5 DIAG 6 PGND2 7 MUTE/ON 8 OUT2 9 IN1 10 OUT2 11 IN2 TDA8591J IN3 16 OUT3 17 IN4 18 OUT3 19 STBY 20 PGND3 21 22 CIN OUT4 23 PGND4 24 OUT4 25 OFFCAP 26 GNDHS 27 MGW450 Fig.2 Pin configuration. ...

Page 7

... Bridge Tied Load (BTL) amplifiers with high output power and low distortion. The gain of each amplifier is fixed at 26 dB. The TDA8591J has two-pin mode control which allows the amplifiers to be switched to standby (off) with the STBY pin, and the MUTE/ON pin to be used to switch between mute mode (input signal suppressed) and amplifier operating mode ...

Page 8

... Diagnostic waveforms: dynamic distortion detection function. MGT604 andbook, halfpage DIAG V P amplifier output GND t (ms) Pull-up resistor = 47 k Fig.6 Diagnostic waveforms: short-circuit Preliminary specification TDA8591J MGT605 active DDD normal normal t (ms) MGU498 short to short to GND (ms) pin or GND. ...

Page 9

... – d short-circuit diagnostic R2 – ------------------------------ - dynamic distortion detection – Fig.7 Internal circuit diagnostic output pin DIAG. 9 Preliminary specification TDA8591J OFFSET IN1 DDD yes 0 yes don’t care 0 1 output offset diagnostic PGND MGT610 IN2 ...

Page 10

... IN1 R1 c. Level shifter. Fig.8 Connecting the DIAG output to a microcontroller input. 2002 Jan into 2 handbook, halfpage MICRO MGU513 handbook, halfpage MICRO- MGU515 10 Preliminary specification TDA8591J V MICRO- CONTROLLER R DIAG MGU514 b. External pull-up DIAG IN2 MICRO- CONTROLLER IN1 R1 MGU516 d ...

Page 11

... Therefore, the EIAJ power is defined and measured at the pins of the IC using the following test conditions: The supply voltage is 14.4 V measured on the pins of the TDA8591J All channels are loaded with 4 simultaneously The input signal is a continuous (no burst) square wave (RMS) ...

Page 12

... P EIAJ ( ( (1) P (infinite slew rate). EIAJ(max) (2) Maximum slew rate of TDA8591J. Fig.9 Comparison of sine wave and square wave RMS powers. 2002 Jan into 2 MGT612 MGT613 MGT614 ( Preliminary specification TDA8591J ...

Page 13

... V to guarantee 2000 0.75 mH (V) 14 2.5 ms 47.5 ms Fig.10 Load dump pulse definition. 13 Preliminary specification TDA8591J MIN. MAX. UNIT + ...

Page 14

... Fig.11 Equivalent thermal resistance network 14.4 V; measured in the circuit of Fig.29; unless otherwise specified CONDITIONS operating to mute mode mute to operating mode mute mode; V MUTE/ON operating mode; V MUTE/ON 14 Preliminary specification TDA8591J VALUE 40 1 OUT4 2 K/W MGT602 MIN. TYP. MAX. 8.0 14.4 18.0 120 200 ...

Page 15

... T virtual junction temperature temperature pre-warning; vj Notes 1. With open MUTE/ON pin, the TDA8591J will switch to operating mode (see Section 7. the offset voltage across the load. Pin OFFCAP should never be left open-circuit. If pin OFFCAP is OO(det) connected to one of the PGND pins, the offset detection is switched off (see Section 14.4). ...

Page 16

... (RMS (p-p); mute or ripple operating mode (RMS 0.35 V (RMS) cm THD + N = 0.5%; P with respect dB; note Preliminary specification TDA8591J MIN. TYP. MAX 41 0.03 0.1 0 ...

Page 17

... P o (W) 100 (V) One channel driven. (1) EIAJ values. (2) THD + N = 10%. (3) THD + N = 1%. Fig.15 Output power as a function of supply 17 Preliminary specification TDA8591J = kHz; 80 kHz filter (1) (2) ( ...

Page 18

... (1) Separation between channels 4 and 1. (2) Separation between channels 4 and 2. (3) Separation between channels 4 and 3. Fig.19 Channel separation as a function of 18 Preliminary specification TDA8591J MGW462 (1) (2) ( (Hz) frequency; channel 2 driven. MGW464 (1) (2) ...

Page 19

... Fig.21 Total harmonic distortion plus noise MGW466 10 handbook, halfpage THD N (%) (Hz Fig.23 Total harmonic distortion plus noise Preliminary specification TDA8591J 2 1 (1) 1 (2) ( (W) function of output power (1) ( ...

Page 20

... Fig.25 Power dissipation as a function of output power; R MGW471 30 handbook, halfpage P ( (W) IEC60268 filtered noise; one channel driven. Fig.27 Power dissipation as a function of output power Preliminary specification TDA8591J MGW470 ( MGW472 ...

Page 21

... Philips Semiconductors into quad BTL car radio power amplifier 0 handbook, halfpage SVRR (dB (p-p). ripple Fig.28 Supply voltage ripple rejection as a function of frequency. 2002 Jan into 2 MGW473 (Hz) 21 Preliminary specification TDA8591J ...

Page 22

... V P TDA8591J INTERFACE OFFSET DIAGNOSTIC DETECTION PGND1 PGND2 PGND3 PGND4 Fig.29 Test circuit. 22 Preliminary specification TDA8591J V P 2200 F ( OUT1 3 4 OUT1 OUT2 9 4 OUT2 CHARGE PUMP 220 ...

Page 23

... Jan into 2 100 TDA8591J OUT IN OUT STBY GND Fig.30 Open ground pin test set-up. 100 TDA8591J OUT IN OUT STBY GND Fig.31 Open power supply (pin Preliminary specification TDA8591J (1) 14.4 V battery MGW453 (1) 14.4 V battery MGW454 ) test set-up. ...

Page 24

... BTL car radio power amplifier handbook, full pagewidth IN 4700 F (1) Cable length is 1 metre, cable diameter is 1.5 mm. Fig.32 Reversed polarity power supply test set-up. 2002 Jan into 2 100 fuse TDA8591J OUT OUT e.g.BZW03C18 GND 24 Preliminary specification TDA8591J (1) 14.4 V battery MGW455 ...

Page 25

... CIN 22 SGND 2 IN3 IN4 18 STBY 20 INTERFACE 8 OFFSET DETECTION 2 (10 V) PGND1 PGND2 PGND3 25 Preliminary specification TDA8591J V P 2200 F ( OUT1 3 OUT1 OUT2 9 OUT2 CHARGE PUMP 220 OUT3 19 OUT3 OUT4 ...

Page 26

... TDA8591J IN4 18 20 INTERFACE 8 OFFSET DETECTION PGND1 PGND2 PGND3 PGND4 26 Preliminary specification TDA8591J V P 2200 F ( OUT1 OUT1 220 k 220 OUT2 OUT2 CHARGE PUMP 220 ...

Page 27

... Special attention should be paid to this f issue when selecting SMD capacitors at the four inputs (MKT capacitors are recommended). 14.2 Capacitors on outputs The TDA8591J is optimized for a capacitor from each output to ground for RF immunity and ESD. These capacitors can be replaced by the capacitors on the connector block. 14.3 EMC precautions The TDA8591J has an all N-type DMOS output stage ...

Page 28

... BTL car radio power amplifier 14.7 PCB layout handbook, full pagewidth GND 8-18V V P diag TDA8591J Dimensions in mm. 2002 Jan into 2 85.1 Out1 Out2 Out3 gnd float In1 In2 In3 In4 gnd Fig.35 PCB layout (component side). 28 Preliminary specification TDA8591J 39.4 2.2 F Out4 On Mute Off MGW474 ...

Page 29

... Dimensions in mm. 2002 Jan into 2 85.1 220 nF 220 220 k 220 k 220 k 220 Fig.36 PCB layout (soldering side). 29 Preliminary specification TDA8591J 39 GND V P MGW475 ...

Page 30

... V) (1) 220 nF (2) 220 TDA8591J Fig.37 PCB design advice. 30 Preliminary specification TDA8591J 15 2 (6.3 V) (3) OUT1 ( OUT1 22 nF OUT2 22 nF OUT2 22 nF OUT3 22 nF OUT3 22 nF OUT4 22 nF OUT4 2 ...

Page 31

... scale (1) ( 30.4 28.0 12.2 10.15 12 2.0 1.0 4.0 6 29.9 27.5 11.8 9.85 REFERENCES JEDEC EIAJ 31 Preliminary specification TDA8591J view B: mounting base side 1.85 8.4 2.4 2.1 4.3 ...

Page 32

... If the temperature of the soldering iron bit is less than 300 C it may remain in contact for seconds. If the bit temperature is between 300 and 400 C, contact may seconds. SOLDERING METHOD DIPPING suitable 32 Preliminary specification TDA8591J ). If the stg(max) WAVE (1) suitable ...

Page 33

... Preliminary specification TDA8591J DEFINITIONS These products are not Philips Semiconductors ...

Page 34

... Philips Semiconductors into quad BTL car radio power amplifier 2002 Jan into 2 NOTES 34 Preliminary specification TDA8591J ...

Page 35

... Philips Semiconductors into quad BTL car radio power amplifier 2002 Jan into 2 NOTES 35 Preliminary specification TDA8591J ...

Page 36

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...

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