pca9901 NXP Semiconductors, pca9901 Datasheet - Page 23

• Manufacturer Part Number: pca9901
• Description: One Wire Single Led Driver
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PCA9901_1
Product data sheet
16.3.1 Stand off
Table 9.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
The stand off between the substrate and the chip is determined by:
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 16. Temperature profiles for large and small components
•
•
•
•
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
The amount of printed solder on the substrate
The size of the solder land on the substrate
temperature
MSL: Moisture Sensitivity Level
Lead-free process (from J-STD-020C)
Figure
Rev. 01 — 3 December 2009
16.
= minimum soldering temperature
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
)
350 to 2 000
260
250
245
Table
9.
One wire single LED driver
temperature
peak
PCA9901
> 2 000
260
245
245
© NXP B.V. 2009. All rights reserved.
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